JAJS382C September   2009  – April 2018 TPS54318

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency PWM Control
      2. 8.3.2  Slope Compensation and Output Current
      3. 8.3.3  Bootstrap Voltage (Boot) and Low Dropout Operation
      4. 8.3.4  Error Amplifier
      5. 8.3.5  Voltage Reference
      6. 8.3.6  Adjusting the Output Voltage
      7. 8.3.7  Enable and Adjusting Undervoltage Lockout
      8. 8.3.8  Soft-Start Pin
      9. 8.3.9  Sequencing
      10. 8.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      11. 8.3.11 Overcurrent Protection
      12. 8.3.12 Frequency Shift
      13. 8.3.13 Reverse Overcurrent Protection
      14. 8.3.14 Synchronize Using the RT/CLK Pin
      15. 8.3.15 Power Good (PWRGD Pin)
      16. 8.3.16 Overvoltage Transient Protection
      17. 8.3.17 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Small Signal Model for Loop Response
      2. 8.4.2 Simple Small Signal Model for Peak Current Mode Control
      3. 8.4.3 Small Signal Model for Frequency Compensation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Step One: Select the Switching Frequency
        2. 9.2.2.2  Step Two: Select the Output Inductor
        3. 9.2.2.3  Step Three: Choose the Output Capacitor
        4. 9.2.2.4  Step Four: Select the Input Capacitor
        5. 9.2.2.5  Step Five: Minimum Load DC COMP Voltage
        6. 9.2.2.6  Step Six: Choose the Soft-Start Capacitor
        7. 9.2.2.7  Step Seven: Select the Bootstrap Capacitor
        8. 9.2.2.8  Step Eight: Undervoltage Lockout Threshold
        9. 9.2.2.9  Step Nine: Select Output Voltage and Feedback Resistors
          1. 9.2.2.9.1 Output Voltage Limitations
        10. 9.2.2.10 Step 10: Select Loop Compensation Components
        11. 9.2.2.11 Power Dissipation Estimate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 WEBENCH®ツールによるカスタム設計
      2. 12.1.2 開発サポート
    2. 12.2 商標
    3. 12.3 静電気放電に関する注意事項
    4. 12.4 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information(2)

THERMAL METRIC(1) TPS54318 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 50 °C/W
RθJA Junction-to-ambient thermal resistance (3) 37
RθJC(top) Junction-to-case (top) thermal resistance 59.1
RθJB Junction-to-board thermal resistance 23.1
ψJT Junction-to-top characterization parameter 1.4
ψJB Junction-to-board characterization parameter 23.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Unless otherwise specified, metrics listed in this table refer to JEDEC high-K board measurements
(3) Test Board Conditions:
  • 2 inches × 2 inches, 4 layers, thickness: 0.062 inch
  • 2 oz. copper traces located on the top of the PCB
  • 2 oz. copper ground planes located on the two internal layers and bottom layer
  • 4 thermal vias (10 mil) located under the device package