JAJSGM5 December   2018 TPS54340B

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      効率と負荷電流との関係
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency PWM Control
      2. 8.3.2  Slope Compensation Output Current
      3. 8.3.3  Pulse Skip Eco-mode
      4. 8.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 8.3.5  Error Amplifier
      6. 8.3.6  Adjusting the Output Voltage
      7. 8.3.7  Enable and Adjusting Undervoltage Lockout
      8. 8.3.8  Internal Soft Start
      9. 8.3.9  Constant Switching Frequency and Timing Resistor (RT/CLK) pin)
      10. 8.3.10 Accurate Current Limit Operation and Maximum Switching Frequency
      11. 8.3.11 Synchronization to RT/CLK pin
      12. 8.3.12 Overvoltage Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Small Signal Model for Loop Response
      15. 8.3.15 Simple Small Signal Model for Peak-Current-Mode Control
      16. 8.3.16 Small Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VIN ≤ 4.5 V (Minimum VIN)
      2. 8.4.2 Operation with EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Buck Converter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1  Custom Design with WEBENCH® Tools
        2. 9.2.2.2  Selecting the Switching Frequency
        3. 9.2.2.3  Output Inductor Selection (LO)
        4. 9.2.2.4  Output Capacitor
        5. 9.2.2.5  Catch Diode
        6. 9.2.2.6  Input Capacitor
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Undervoltage Lockout Setpoint
        9. 9.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 9.2.2.10 Minimum VIN
        11. 9.2.2.11 Compensation
        12. 9.2.2.12 Discontinuous Conduction Mode and Eco-mode Boundary
        13. 9.2.2.13 Power Dissipation
      3. 9.2.3 Application Curves
    3. 9.3 Other Applications
      1. 9.3.1 Inverting Power
      2. 9.3.2 Split-Rail Power Supply
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Estimated Circuit Area
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 WEBENCH®ツールによるカスタム設計
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) TPS54340B UNIT
DDA (HSOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 42 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.8 °C/W
RθJB Junction-to-board thermal resistance 23.4 °C/W
ψJT Junction-to-top characterization parameter 5.9 °C/W
ψJB Junction-to-board characterization parameter 23.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.