JAJSBU6B May   2013  – October 2023 TPS54531

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Voltage Reference (Vref)
      3. 7.3.3  Bootstrap Voltage (BOOT)
      4. 7.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 7.3.5  Programmable Slow Start Using SS Pin
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation
      8. 7.3.8  Current-Mode Compensation Design
      9. 7.3.9  Overcurrent Protection and Frequency Shift
      10. 7.3.10 Overvoltage Transient Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode
      2. 7.4.2 Operation With VIN < 3.5 V
      3. 7.4.3 Operation With EN Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Output Voltage Set Point
        4. 8.2.2.4  Undervoltage Lockout Set Point
        5. 8.2.2.5  Input Capacitors
        6. 8.2.2.6  Output Filter Components
          1. 8.2.2.6.1 Inductor Selection
          2. 8.2.2.6.2 Capacitor Selection
        7. 8.2.2.7  Compensation Components
        8. 8.2.2.8  Bootstrap Capacitor
        9. 8.2.2.9  Catch Diode
        10. 8.2.2.10 Slow-Start Capacitor
        11. 8.2.2.11 Output Voltage Limitations
        12. 8.2.2.12 Power Dissipation Estimate
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Electromagnetic Interference (EMI) Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.11 Thermal Shutdown

The device implements an internal thermal shutdown to protect the device if the junction temperature exceeds 165°C. The thermal shutdown forces the device to stop switching when the junction temperature exceeds the thermal trip threshold. When the die temperature decreases below 165°C, the device reinitiates the power-up sequence.