JAJSQB9 January 2024 TPS56A37
PRODUCTION DATA
THERMAL METRIC(1) | TPS56A37 | UNIT | |
---|---|---|---|
QFN HotRod | |||
10 PINS | |||
RθJA | Junction-to-ambient thermal resistance (JEDEC)(2) | 68.1 | °C/W |
Eff RθJA | Effective junction-to-ambient thermal resistance (4-layer TI EVM) | 30 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 40.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 17.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 1.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 17.2 | °C/W |