JAJSQB9 January   2024 TPS56A37

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  The Adaptive On-Time Control and PWM Operation
      2. 6.3.2  Power Up Sequence
      3. 6.3.3  Eco-mode Control Scheme
      4. 6.3.4  Soft Start and Prebiased Soft Start
      5. 6.3.5  Enable and Adjusting Undervoltage Lockout
      6. 6.3.6  Output Overcurrent Limit and Undervoltage Protection
      7. 6.3.7  Overvoltage Protection
      8. 6.3.8  UVLO Protection
      9. 6.3.9  Thermal Shutdown
      10. 6.3.10 Output Voltage Discharge
      11. 6.3.11 Power Good
      12. 6.3.12 Large Duty Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby Operation
      2. 6.4.2 Light Load Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Resistors Selection
        2. 7.2.2.2 Output Filter Selection
        3. 7.2.2.3 Input Capacitor Selection
        4. 7.2.2.4 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TPS56A37 UNIT
QFN HotRod
10 PINS
RθJA Junction-to-ambient thermal resistance (JEDEC)(2) 68.1 °C/W
Eff RθJA Effective junction-to-ambient thermal resistance (4-layer TI EVM) 30 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.4 °C/W
RθJB Junction-to-board thermal resistance 17.6 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 17.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) This junction-to-ambient thermal resistance (JEDEC) is based on JEDEC standard EVM without GND thermal vias.