JAJSCB9 June 2016 TPS61021A
PRODUCTION DATA.
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
Voltage range at terminals(2) | EN, FB | DC | –0.3 | 3.6 | V |
VIN, SW, VOUT | DC | –0.3 | 4.6 | V | |
10% duty cycle | –0.3 | 4.8 | V | ||
Operating junction temperature, TJ | –40 | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
VIN | Input voltage range | 0.5 | 4.4 | V | ||
VOUT | Output voltage setting range | 1.8 | 4.0 | V | ||
L | Effective inductance range | 0.2 | 0.47 | 1.3 | µH | |
CIN | Effective input capacitance range | 1.0 | 4.7 | µF | ||
COUT | Effective output capacitance range | IOUT ≤ 0.3 A | 3.0 | 10 | 200 | µF |
IOUT > 0.3 A | 10 | 20 | 200 | µF | ||
TJ | Operating junction temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPS61021A | UNIT | |
---|---|---|---|
DSG (WSON) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 71.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 95.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 41.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 3.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 13.0 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
POWER SUPPLY | ||||||
VIN | Input voltage range | 0.5 | 4.4 | V | ||
VIN_UVLO | Under-voltage lockout threshold | VIN rising | 0.8 | 0.9 | V | |
VIN falling | 0.28 | 0.4 | 0.5 | V | ||
IQ | Quiescent current into VIN pin | IC enabled, No load, No switching VIN = 1.8 V to 3.6 V, VFB = VREF + 0.1 V, TJ up to 85°C | 3.0 | µA | ||
Quiescent current into VOUT pin | IC enabled, No load, No switching VOUT = 1.8 V to 4.0 V, VFB = VREF + 0.1 V, TJ up to 85°C | 17 | 30 | µA | ||
ISD | Shutdown current into VIN and SW pin | IC disabled, VIN = 1.8 V to 3.6 V, TJ up to 85°C | 0.5 | 3.0 | µA | |
OUTPUT | ||||||
VOUT | Output voltage setting range | 1.8 | 4.0 | V | ||
VREF | Reference voltage at the FB pin | PWM mode | 775 | 795 | 815 | mV |
PFM mode | 801 | mV | ||||
VOVP | Output over-voltage protection threshold | VOUT rising | 4.15 | 4.35 | 4.60 | V |
VOVP_HYS | Over-voltage protection hysteresis | 0.1 | V | |||
IFB_LKG | Leakage current at FB pin | 20 | nA | |||
ISW_LKG | Leakage current into SW pin | IC disabled, TJ up to 85°C | 3.0 | µA | ||
IVOUT_LKG | Leakage current into VOUT pin | IC disabled, VOUT = 4.0 V, TJ up to 85°C | 1 | 2 | µA | |
POWER SWITCH | ||||||
RDS(on) | High-side MOSFET on resistance | VOUT = 3.3 V | 51 | mΩ | ||
Low-side MOSFET on resistance | VOUT = 3.3 V | 58 | mΩ | |||
fSW | Switching frequency | VIN = 2.4 V, VOUT = 3.3 V, PWM mode | 2.0 | MHZ | ||
tOFF_min | Minimum off time | 80 | 120 | ns | ||
ILIM_SW | Valley current limit | VIN = 2.4 V, VOUT = 3.3 V | 3.0 | 4.3 | A | |
LOGIC INTERFACE | ||||||
VEN_H | EN Logic high threshold | VIN > 1.2 V | 0.84 | V | ||
VIN ≤ 1.2 V | 0.7 x VIN | |||||
VEN_L | EN Logic Low threshold | VIN > 1.2 V | 0.36 | V | ||
VIN ≤ 1.2 V | 0.3 x VIN | |||||
PROTECTION | ||||||
TSD | Thermal shutdown threshold | TJ rising | 150 | °C | ||
TSD_HYS | Thermal shutdown hysteresis | TJ falling below TSD | 20 | °C |
VIN = 0.9 V, 1.2 V, 1.8 V, 2.4 V, 3.0 V, and VOUT = 3.3 V | ||
VIN = 0.7 V to 3.6 V, VOUT = 2.5 V, 3.3 V, 4.0 V | ||
VIN = 2.4 V, VOUT = 3.3 V, T = –40°C to 125°C | ||
VIN = 1.2 V, VOUT = 1.8 V to 4.0 V, No switching | ||
VIN = 2.4 V, Into VIN and SW, T = –40°C to 85°C | ||
VIN = 2.4 V, and VOUT = 2.5 V, 3.3 V, 4.0 V | ||
VIN = 0.9 V, 1.6 V, 2.4 V, 3.0 V, and VOUT = 3.3 V | ||
VIN = 0.9 V to 3.6 V, VOUT = 4.0 V, No switching | ||
VIN = 2.4 V, VOUT = 3.3 V, No switching, T = –40°C to 85°C | ||