JAJSUU2B October   2014  – June 2024 TPS61169

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Soft Start-Up
      2. 6.3.2 Open LED Protection
      3. 6.3.3 Shutdown
      4. 6.3.4 Current Program
      5. 6.3.5 LED Brightness Dimming
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Thermal Foldback and Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation With CTRL
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Output Capacitor Selection
        4. 7.2.2.4 LED Current Set Resistor
        5. 7.2.2.5 Thermal Considerations
    3. 7.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3.7 Thermal Foldback and Thermal Shutdown

When TPS61169 drives heavy load for large size panel applications, the power dissipation increases a lot and the device junction temperature may reach a very high value, affecting the device function and reliability. In order to lower the thermal stress, the TPS61169 features a thermal foldback function. When the junction temperature is higher than 100°C, the switch current limit ILIM is reduced automatically as Figure 5-2 shows. This thermal foldback mechanism controls the power dissipation and keeps the junction temperature from rising to a very high value. If the typical junction temperature of 160°C is exceeded, an internal thermal shutdown turns off the device. The device is released from shutdown automatically when the junction temperature decreases by 15°C.