SLVSAQ2C January   2014  – October 2014 TPS61230 , TPS61232

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Startup
      2. 8.3.2 Current Limit Operation
      3. 8.3.3 Enable/Disable
      4. 8.3.4 Undervoltage Lockout
      5. 8.3.5 Output Capacitor Discharge, TPS61231
      6. 8.3.6 Power Good Output
      7. 8.3.7 Over Voltage Protection
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Boost Normal Mode
      2. 8.4.2 Boost Power Save Mode
      3. 8.4.3 Zero Duty Cycle Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPS61230 2.3-V to 5.5-V Input, 5-V Output Converter
        1. 9.2.1.1 TPS61230 5-V Output Design Requirements
        2. 9.2.1.2 TPS61230 5-V Detailed Design Procedure
          1. 9.2.1.2.1 Programming the Output Voltage
          2. 9.2.1.2.2 Inductor and Capacitor Selection
            1. 9.2.1.2.2.1 Inductor Selection
            2. 9.2.1.2.2.2 Output Capacitor Selection
            3. 9.2.1.2.2.3 Input Capacitor Selection
          3. 9.2.1.2.3 Loop Stability, Feed Forward Capacitor
        3. 9.2.1.3 TPS61230 5-V Output Application Performance Plots
      2. 9.2.2 TPS61230 2.3-V to 5.5-V Input, 3.5-V Output Converter
        1. 9.2.2.1 TPS61230 3.5-V Output Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 TPS61230 3.5-V Output Application Performance Plots
      3. 9.2.3 TPS61230 Application with Feed Forward Capacitor for Best Transient Response
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

Optimizing Transient Response of Internally Compensated dc-dc Converters With Feedforward CapacitorSLVA289

Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017)

Semiconductor and IC Package Thermal Metrics (SPRA953)

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS61230 Click here Click here Click here Click here Click here
TPS61231 Click here Click here Click here Click here Click here
TPS61232 Click here Click here Click here Click here Click here

12.4 Trademarks

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.