JAJSVH7A October   2024  – November 2024 TPS61287

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Start-up
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Programmable EN/UVLO
      4. 6.3.4 Switching Valley Current Limit
      5. 6.3.5 External Clock Synchronization
      6. 6.3.6 Stackable Multi-phase Operation
      7. 6.3.7 Device Functional Modes
        1. 6.3.7.1 Forced PWM Mode
        2. 6.3.7.2 Auto PFM Mode
      8. 6.3.8 Overvoltage Protection
      9. 6.3.9 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting Output Voltage
        2. 7.2.2.2 Inductor Selection
        3. 7.2.2.3 Bootstrap And VCC Capacitors Selection
        4. 7.2.2.4 MOSFET Selection
        5. 7.2.2.5 Input Capacitor Selection
        6. 7.2.2.6 Output Capacitor Selection
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC TPS61287 TPS61287 UNIT
RZP (VQFN) - 14 PINS RZP (VQFN) - 14 PINS
EVM(2) Standard(1)
RθJA Junction-to-ambient thermal resistance 36.6 64.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance N/A 41.2 °C/W
RθJB Junction-to-board thermal resistance N/A 18.8 °C/W
ΨJT Junction-to-top characterization parameter 1.4 1.4 °C/W
ΨJB Junction-to-board characterization parameter 18.7 18.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Measured on TPS61287EVM, 4-layer, 2oz copper PCB.