JAJSI60 November   2019 TPS61391

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      代表的なアプリケーション回路
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Recommended Operating Conditions
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 ESD Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Current Mirror
      4. 7.3.4 High Optical Power Protection
    4. 7.4 Device Functional Mode
      1. 7.4.1 PFM Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirement
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Rectifier Diode
        2. 8.2.2.2  Selecting the Inductor
        3. 8.2.2.3  Selecting Output Capacitor
        4. 8.2.2.4  Selecting Filter Resistor and Capacitor
        5. 8.2.2.5  Setting the Output Voltage
        6. 8.2.2.6  Selecting Capacitor for CAP pin
        7. 8.2.2.7  Selecting Capacitor for AVCC pin
        8. 8.2.2.8  Selecting Capacitor for APD pin
        9. 8.2.2.9  Selecting the Resistors of MON1 or MON2
        10. 8.2.2.10 Selecting the Capacitors of MON1 or MON2
        11. 8.2.2.11 Selecting the Short Current Limit
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Pin Configuration and Functions

RTE Package
16-Pin WQFN
Top View
TPS61391 RTE_wqfn-162_SLVSFE7.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
NC 1,2 N/A No internal connection
MON2 3 O Current mirror output pin of 1 : 5 ratio (Mirror current: APD current)
MON1 4 O Current mirror output pin of 4 : 5 ratio (Mirror current: APD current)
APD 5 O Power supply for the APD, connect this pin with the cathode of APD
MONIN 6 I Current mirror input pin
GND 7 Power Ground
SW 8 PWR The switching node pin of the converter. It is connected to the drain of the internal low-side power MOSFET and the source of the internal high-side power MOSFET
CAP 9 O Connecting a capacitor externally to lower the noise for current mirror.
VIN 10 I IC power supply input
ISHORT 11 O Programming the current limit for high optical power protection by a resistor between this pin and GND.
FB 12 I Feedback voltage
EN 13 I Enable logic input. Logic high level enables the device. Logic low level disables the device and turns it into shutdown mode
AVCC 14,15 I Power supply for the current monitor circuitry
AGND 16 Analog ground for the current monitor circuitry
Exposed Thermal Pad Connect with GND, TI recommends connecting to Power GND on PCB