JAJSE17 October 2017 TPS6508700
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
Figure 3-1 shows the 64-pin RSK plastic quad-flatpack no-lead package with exposed thermal pad.
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
SMPS REGULATORS | |||
1 | FBGND2 | I | Remote negative feedback sense for BUCK2 controller. Connect to negative terminal of output capacitor or input capacitor of load. |
2 | FBVOUT2 | I | Remote positive feedback sense for BUCK2 controller. Connect to positive terminal of output capacitor or input capacitor of load. |
3 | DRVH2 | O | High-side gate driver output for BUCK2 controller. |
4 | SW2 | I | Switch node connection for BUCK2 controller. |
5 | BOOT2 | I | Bootstrap pin for BUCK2 controller. Connect a 100-nF ceramic capacitor between this pin and SW2 pin. |
6 | PGNDSNS2 | I | Power GND sense connection for BUCK2. Connect to ground terminal of external low-side FET. |
7 | DRVL2 | O | Low-side gate driver output for BUCK2 controller. |
8 | DRV5V_2_A1 | I | 5-V supply to BUCK2 gate driver and LDOA1. Bypass to ground with a 2.2-µF (typical) ceramic capacitor. Shorted on board to LDO5P0 pin. |
10 | LX3 | O | Switch node connection for BUCK3 converter. |
11 | PVIN3 | I | Power input to BUCK3 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. |
12 | FB3 | I | Remote feedback sense for BUCK3 converter. Connect to positive terminal of output capacitor. |
20 | LX5 | O | Switch node connection for BUCK5 converter. |
21 | PVIN5 | I | Power input to BUCK5 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. |
22 | FB5 | I | Remote feedback sense for BUCK5 converter. Connect to positive terminal of output capacitor. |
23 | FB4 | I | Remote feedback sense for BUCK4 converter. Connect to positive terminal of output capacitor. |
24 | PVIN4 | I | Power input to BUCK4 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. |
25 | LX4 | O | Switch node connection for BUCK4 converter. |
29 | FBVOUT1 | I | Remote feedback sense for BUCK1 controller. Connect to external feedback near either output capacitor or input capacitor of load. Recommend a 4.7-pF feedforward capacitor. |
30 | ILIM1 | I | Current limit set pin for BUCK1 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. |
33 | DRVH1 | O | High-side gate driver output for BUCK1 controller. |
34 | SW1 | I | Switch node connection for BUCK1 controller. |
35 | BOOT1 | I | Bootstrap pin for BUCK1 controller. Connect a 100-nF ceramic capacitor between this pin and SW1 pin. |
36 | PGNDSNS1 | I | Power GND sense connection for BUCK1. Connect to ground terminal of external low-side FET. |
37 | DRVL1 | O | Low-side gate driver output for BUCK1 controller. |
38 | DRV5V_1_6 | I | 5-V supply to BUCK1 and BUCK6 gate drivers. Bypass to ground with a 2.2-µF (typical) ceramic capacitor. Shorted on board to LDO5P0 pin. |
39 | DRVL6 | O | Low-side gate driver output for BUCK6 controller. |
40 | PGNDSNS6 | I | Power GND sense connection for BUCK6. Connect to ground terminal of external low-side FET. |
41 | BOOT6 | I | Bootstrap pin for BUCK6 controller. Connect a 100-nF ceramic capacitor between this pin and SW6 pin. |
42 | SW6 | I | Switch node connection for BUCK6 controller. |
43 | DRVH6 | O | High-side gate driver output for BUCK6 controller. |
44 | FBVOUT6 | I | Remote feedback sense for BUCK6 controller. Connect to positive terminal of output capacitor or input capacitor of load. |
45 | ILIM6 | I | Current limit set pin for BUCK6 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. |
64 | ILIM2 | I | Current limit set pin for BUCK2 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. |
LDO AND LOAD SWITCHES | |||
9 | LDOA1 | O | LDOA1 output. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. |
17 | SWB1 | O | Output of load switch B1. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use. |
18 | PVINSWB1_B2 | I | Power supply to load switch B1 and B2. Bypass to ground with a 1-µF (typical) ceramic capacitor to improve transient performance. Connect to ground when not in use. |
19 | SWB2 | O | Output of load switch B2. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use. |
31 | SWA1 | O | Output of load switch A1. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use. |
32 | PVINSWA1 | I | Power supply to load switch A1. Bypass to ground with a 1-µF (typical) ceramic capacitor to improve transient performance. Connect to ground when not in use. |
46 | PVINVTT | I | Power supply to VTT LDO. Bypass to ground with a 10-µF (minimum) ceramic capacitor. Connect to ground when not in use. |
47 | VTT | O | Output of load VTT LDO. Bypass to ground with 2× 22-µF (minimum) ceramic capacitors. Leave floating when not in use. |
48 | VTTFB | I | Remote feedback sense for VTT LDO. Connect to positive terminal of output capacitor. Leave floating when not in use. |
49 | LDOA3 | O | Output of LDOA3. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Leave floating when not in use. |
50 | PVINLDOA2_A3 | I | Power supply to LDOA2 and LDOA3. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Connect to ground when not in use. |
51 | LDOA2 | O | Output of LDOA2. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Leave floating when not in use. |
54 | LDO3P3 | O | Output of 3.3-V internal LDO. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. |
56 | LDO5P0 | O | Output of 5-V internal LDO or an internal switch that connects this pin to V5ANA. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. |
57 | V5ANA | I | External 5-V supply input to internal load switch that connects this pin to LDO5P0 pin. Bypass this pin with an optional ceramic capacitor to improve transient performance. |
INTERFACE | |||
13 | CTL1 | I | Active-high enable pin for BUCK4, BUCK5, and BUCK6. Connect to AND of GPIO_G3 and EN_S5 for typical sequencing. |
14 | CTL6/SLPENB2 | I | Active-high unused control signal. Sleep state control for BUCK6 (masked). |
15 | IRQB | O | Open-drain output interrupt pin. Refer to Section 5.9.3 for definitions. |
16 | GPO1 | O | PG_S5 output indicates S5 power state has been reached. Open drain output, pull up to appropriate voltage rail. |
26 | GPO2 | O | PG_S0 output indicates S0 power state has been reached. Open drain output, pull up to appropriate voltage rail. |
27 | GPO3 | O | General purpose output that is configured to push-pull output at 3.3V and controlled by I2C. Default state is low. |
28 | GPO4 | O | General purpose output that is configured to open-drain output and controlled by I2C. Default state is high. |
58 | CLK | I | I2C clock |
59 | DATA | I/O | I2C data |
60 | CTL2 | I | Active-high LDOA2 and LDOA3 enable. Tie to GND unless using this pin to disable LDOA2 and LDOA3 after enabling them by I2C. |
61 | CTL3/SLPENB1 | I | Active-high VTT LDO enable and sleep state control for BUCK1-BUCK5 (masked), LDOA2, and LDOA3. |
62 | CTL4 | I | Active-high enable pin for BUCK1 and BUCK3. Connect to OR of CTL1 input and inverted GPIO_G3 for typical sequencing. SWA1, SWB1, and SWB2 can also use CTL4 if configured by I2C after boot. |
63 | CTL5 | I | Active-high enable pin for BUCK2. Connect to EN_S0 for typical sequencing. |
REFERENCE | |||
53 | VREF | O | Band-gap reference output. Stabilize it by connecting a 100-nF (typical) ceramic capacitor between this pin and quiet ground. |
52 | AGND | — | Analog ground. Do not connect to the thermal pad ground on top layer. Connect to ground of VREF capacitor. |
55 | VSYS | I | System voltage detection and input to internal LDOs (3.3 V and 5 V). Bypass to ground with a 1-µF (typical) ceramic capacitor. |
THERMAL PAD | |||
— | Thermal pad | — | Connect to PCB ground plane using multiple vias for good thermal and electrical performance. |