JAJSOJ1E March 2004 – April 2022 TPS65130 , TPS65131
PRODUCTION DATA
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Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues, such as thermal coupling, airflow, added heatsinks and convection surfaces, and the presence of heat-generating components affect the power-dissipation limits of a given component.
These three basic approaches enhance thermal performance:
The recommended device junction temperature range, TJ, is –40°C to 125°C. The thermal resistance of the 24-pin QFN, 4–mm × 4–mm package (RGE) is RθJA = 34.1°C/W. The recommended operating ambient temperature range for the device is TA = –40°C to 85°C. Use Equation 13 to calculate the maximum power dissipation, PDmax, as a function of TA. In this equation, use TJ = 125°C to operate the device within the recommended temperature range, use TJ = TTS to determine the absolute maximum threshold when the device might go into thermal shutdown. If the maximum ambient temperature of the application is lower, more heat dissipation is possible.