JAJSE75B December   2017  – September 2018 TPS65218D0

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 概略回路図
  2. 2 改訂履歴
  3. 3 Pin Configuration and Functions
    1. 3.1 Pin Functions
      1.      Pin Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 5.3.1.1  Power-Up Sequencing
        2. 5.3.1.2  Power-Down Sequencing
        3. 5.3.1.3  Strobes 1 and 2
        4. 5.3.1.4  Supply Voltage Supervisor and Power Good (PGOOD)
        5. 5.3.1.5  Backup Supply Power-Good (PGOOD_BU)
        6. 5.3.1.6  Internal LDO (INT_LDO)
        7. 5.3.1.7  Current Limited Load Switches
          1. 5.3.1.7.1 Load Switch 1 (LS1)
          2. 5.3.1.7.2 Load Switch 2 (LS2)
          3. 5.3.1.7.3 Load Switch 3 (LS3)
        8. 5.3.1.8  LDO1
        9. 5.3.1.9  Coin Cell Battery Voltage Acquisition
        10. 5.3.1.10 UVLO
        11. 5.3.1.11 Power-Fail Comparator
        12. 5.3.1.12 Battery-Backup Supply Power-Path
        13. 5.3.1.13 DCDC3 / DCDC4 Power-Up Default Selection
        14. 5.3.1.14 I/O Configuration
          1. 5.3.1.14.1 Configuring GPO2 as Open-Drain Output
          2. 5.3.1.14.2 Using GPIO3 as Reset Signal to DCDC1 and DCDC2
        15. 5.3.1.15 Push Button Input (PB)
          1. 5.3.1.15.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 5.3.1.15.2 Push Button Reset
        16. 5.3.1.16 AC_DET Input (AC_DET)
        17. 5.3.1.17 Interrupt Pin (INT)
        18. 5.3.1.18 I2C Bus Operation
    4. 5.4 Device Functional Modes
      1. 5.4.1 Modes of Operation
      2. 5.4.2 OFF
      3. 5.4.3 ACTIVE
      4. 5.4.4 SUSPEND
      5. 5.4.5 RESET
    5. 5.5 Programming
      1. 5.5.1 Programming Power-Up Default Values
    6. 5.6 Register Maps
      1. 5.6.1 Password Protection
      2. 5.6.2 Freshness Seal (FSEAL) Bit
      3. 5.6.3 FLAG Register
      4. 5.6.4 TPS65218D0 Registers
        1. 5.6.4.1  CHIPID Register (subaddress = 0x0) [reset = 0x5]
          1. Table 5-8 CHIPID Register Field Descriptions
        2. 5.6.4.2  INT1 Register (subaddress = 0x1) [reset = 0x0]
          1. Table 5-9 INT1 Register Field Descriptions
        3. 5.6.4.3  INT2 Register (subaddress = 0x2) [reset = 0x0]
          1. Table 5-10 INT2 Register Field Descriptions
        4. 5.6.4.4  INT_MASK1 Register (subaddress = 0x3) [reset = 0x0]
          1. Table 5-11 INT_MASK1 Register Field Descriptions
        5. 5.6.4.5  INT_MASK2 Register (subaddress = 0x4) [reset = 0x0]
          1. Table 5-12 INT_MASK2 Register Field Descriptions
        6. 5.6.4.6  STATUS Register (subaddress = 0x5) [reset = 00XXXXXXb]
          1. Table 5-13 STATUS Register Field Descriptions
        7. 5.6.4.7  CONTROL Register (subaddress = 0x6) [reset = 0x0]
          1. Table 5-14 CONTROL Register Field Descriptions
        8. 5.6.4.8  FLAG Register (subaddress = 0x7) [reset = 0x0]
          1. Table 5-15 FLAG Register Field Descriptions
        9. 5.6.4.9  PASSWORD Register (subaddress = 0x10) [reset = 0x0]
          1. Table 5-16 PASSWORD Register Field Descriptions
        10. 5.6.4.10 ENABLE1 Register (subaddress = 0x11) [reset = 0x0]
          1. Table 5-17 ENABLE1 Register Field Descriptions
        11. 5.6.4.11 ENABLE2 Register (subaddress = 0x12) [reset = 0x0]
          1. Table 5-18 ENABLE2 Register Field Descriptions
        12. 5.6.4.12 CONFIG1 Register (subaddress = 0x13) [reset = 0x4C]
          1. Table 5-19 CONFIG1 Register Field Descriptions
        13. 5.6.4.13 CONFIG2 Register (subaddress = 0x14) [reset = 0xC0]
          1. Table 5-20 CONFIG2 Register Field Descriptions
        14. 5.6.4.14 CONFIG3 Register (subaddress = 0x15) [reset = 0x0]
          1. Table 5-21 CONFIG3 Register Field Descriptions
        15. 5.6.4.15 DCDC1 Register (offset = 0x16) [reset = 0x99]
          1. Table 5-22 DCDC1 Register Field Descriptions
        16. 5.6.4.16 DCDC2 Register (subaddress = 0x17) [reset = 0x99]
          1. Table 5-23 DCDC2 Register Field Descriptions
        17. 5.6.4.17 DCDC3 Register (subaddress = 0x18) [reset = 0x8C]
          1. Table 5-24 DCDC3 Register Field Descriptions
        18. 5.6.4.18 DCDC4 Register (subaddress = 0x19) [reset = 0xB2]
          1. Table 5-25 DCDC4 Register Field Descriptions
        19. 5.6.4.19 SLEW Register (subaddress = 0x1A) [reset = 0x6]
          1. Table 5-26 SLEW Register Field Descriptions
        20. 5.6.4.20 LDO1 Register (subaddress = 0x1B) [reset = 0x1F]
          1. Table 5-27 LDO1 Register Field Descriptions
        21. 5.6.4.21 SEQ1 Register (subaddress = 0x20) [reset = 0x0]
          1. Table 5-28 SEQ1 Register Field Descriptions
        22. 5.6.4.22 SEQ2 Register (subaddress = 0x21) [reset = 0x0]
          1. Table 5-29 SEQ2 Register Field Descriptions
        23. 5.6.4.23 SEQ3 Register (subaddress = 0x22) [reset = 0x98]
          1. Table 5-30 SEQ3 Register Field Descriptions
        24. 5.6.4.24 SEQ4 Register (subaddress = 0x23) [reset = 0x75]
          1. Table 5-31 SEQ4 Register Field Descriptions
        25. 5.6.4.25 SEQ5 Register (subaddress = 0x24) [reset = 0x12]
          1. Table 5-32 SEQ5 Register Field Descriptions
        26. 5.6.4.26 SEQ6 Register (subaddress = 0x25) [reset = 0x63]
          1. Table 5-33 SEQ6 Register Field Descriptions
        27. 5.6.4.27 SEQ7 Register (subaddress = 0x26) [reset = 0x3]
          1. Table 5-34 SEQ7 Register Field Descriptions
  6. 6 Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Applications Without Backup Battery
      2. 6.1.2 Applications Without Battery Backup Supplies
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Output Filter Design
        2. 6.2.2.2 Inductor Selection for Buck Converters
        3. 6.2.2.3 Output Capacitor Selection
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 デバイスおよびドキュメントのサポート
    1. 9.1 デバイス・サポート
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 ドキュメントのサポート
      1. 9.2.1 関連資料
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 Community Resources
    5. 9.5 商標
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 Glossary
  10. 10メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3.1.10 UVLO

Depending on the slew rate of the input voltage into the IN_BIAS pin, the power rails of TPS65218D0 will be enabled at either VULVO or VULVO + VHYS.

If the slew rate of the IN_BIAS voltage is greater than 30 V/s, then TPS65218D0 will power up at VULVO. Once the input voltage rises above this level, the input voltage may drop to the VUVLO level before the PMIC shuts down. In this scenario, if the input voltage were to fall below VUVLO but above 2.55 V, the input voltage would have to recover above VUVLO in less than 5 ms for the device to remain active.

If the slew rate of the IN_BIAS voltage is less than 30 V/s, then TPS65218D0 will power up at VULVO + VHYS. Once the input voltage rises above this level, the input voltage may drop to the VUVLO level before the PMIC shuts down. In this scenario, if the input voltage were to fall below VUVLO but above 2.5 V, the input voltage would have to recover above VUVLO + VHYS in less than 5 ms for the device to remain active.

In either slew rate scenario, if the input voltage were to fall below 2.5 V, the digital core is reset and all remaining power rails are shut down instantaneously and are pulled low to ground by their internal discharge circuitry (DCDC1-4, and LDO1).

TPS65218D0 UVLO_less_than_30Vs_B1_catalog_4_4_2017_slds206.gifFigure 5-15 Definition of UVLO and Hysteresis

After the UVLO triggers, the internal LDO blocks current flow from its output capacitor back to the IN_BIAS pin, allowing the digital core and the discharge circuits to remain powered for a limited amount of time to properly shut-down and discharge the output rails. The hold-up time is determined by the value of the capacitor connected to INT_LDO. See Section 5.3.1.6 for more details.