The TPS65235-1 is designed to
layout in 2‐layer PCB. To ensure reliability of the device, TI recommends following
common printed-circuit board layout guidelines.
- Make sure the ground of input
capacitor, output capacitor, and the boost converter are connected at one
point at same layer.
- The PGND and AGND pins are
located in different regions. Connect these grounds to the thermal pad.
Other components are connected the AGND pin.
- Put the BOOST capacitors as
close as possible.
- The loop from the VIN
inductor to the LX pin must be as short as possible.
- The loop from the VIN
inductor to D1 Schottky diode to the BOOST must be as short as
possible.
- The loop for boost capacitors
to the PGND pin must be within the loop from the LX pin to D1 Schottky diode
to the BOOST pin.