SLVS346D September   2003  – December 2019 TPS723

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Enable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Capacitor Selection for Stability
        2. 8.2.1.2 Output Noise
        3. 8.2.1.3 Power-Supply Rejection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation
      2. 10.1.2 Thermal Protection
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

6.4 Thermal Information

THERMAL METRIC(1) TPS723 UNIT
DBV (SOT23) DDC (SOT23) DRV (WSON)
5 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 206.9 194.8 85.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 120.5 41.4 83.7 °C/W
RθJB Junction-to-board thermal resistance 35.9 35.9 47.3 °C/W
ψJT Junction-to-top characterization parameter 13.3 1.0 3.7 °C/W
ψJB Junction-to-board characterization parameter 35.0 35.7 47.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 31.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.