SBVS128F June 2009 – December 2015 TPS727
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
Application report SLAA414, LDO PSRR Measurement Simplified.
Application report SLAA412, LDO Noise Demystified.
User guide SLVU323, TPS727xxYFF EVM
User guide SLVU325, TPS727xxDSE EVM
PRODUCT | VOUT (2) |
---|---|
TPS727xxx yyy z | XXX is the nominal output voltage. YYY is package designator. Z is package tape and reel quantity (R = 3000, T = 250). |
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
E2E is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
Zigbee is a registered trademark of Zigbee Alliance.
All other trademarks are the property of their respective owners.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.