Place input and output
capacitors as close to the device pins as
possible.
Use copper planes for device
connections to optimize thermal performance.
Place thermal vias around the
device and under the thermal pad to distribute
heat.
Only place tented thermal vias directly beneath
the thermal pad of the DGQ package. An untented
via can wick solder or solder paste away from the
thermal pad joint during the soldering process,
leading to a compromised solder joint on the
thermal pad.