JAJSFH8G June   2011  – March 2020 TPS7A63-Q1 , TPS7A6401-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      固定出力電圧オプション
      2.      可変出力電圧オプション
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Power Up, Reset Delay, and Reset Output
      2. 7.3.2  Adjustable Output Voltage
      3. 7.3.3  Chip Enable
      4. 7.3.4  Charge Pump Operation
      5. 7.3.5  Low-Power Mode
      6. 7.3.6  Undervoltage Shutdown
      7. 7.3.7  Low-Voltage Tracking
      8. 7.3.8  Integrated Fault Protection
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Integrated Window Watchdog
        1. 7.3.10.1 Programmable-Window Watchdog
        2. 7.3.10.2 Watchdog Enable
        3. 7.3.10.3 Watchdog Service Signal
        4. 7.3.10.4 Watchdog Fault Outputs
        5. 7.3.10.5 Watchdog Initialization
        6. 7.3.10.6 Watchdog Operation
        7. 7.3.10.7 Watchdog Fault Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 4 V
      2. 7.4.2 Operation With VIN Larger Than 4 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Example
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Using the TPS7A6333-Q1 or TPS7A6350-Q1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Using the TPS7A6401-Q1
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation and Thermal Considerations
        1. 10.1.1.1 Example
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連リンク
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

For the LDO power supply, especially these high voltage and large current ones, layout is an important step. If layout is not carefully designed, the regulator could not deliver enough output current because of the thermal limitation. To improve the thermal performance of the device, and maximize the current output at high ambient temperature, it is recommended to spread the thermal pad as large as possible and put enough thermal vias on the thermal pad. Figure 37 shows an example layout.