JAJSP60 December   2022 TPS7B4255

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6.     Timing Characteristics
    7. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulated Output (VOUT)
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Current Limit
      5. 7.3.5 VOUT Short to Battery
      6. 7.3.6 Tracking Regulator With an Enable Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 3 V
      2. 7.4.2 Operation With ADJ/EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Dropout Voltage
      2. 8.1.2 Reverse Current
      3. 8.1.3 Signal-Buffering LDO
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Package Mounting
        2. 8.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 8.4.1.3 Power Dissipation and Thermal Considerations
        4. 8.4.1.4 Thermal Performance Versus Copper Area
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS7B4255 UNIT
DBV (SOT-23)(2)
5 PINS
RθJA Junction-to-ambient thermal resistance 176.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.6 °C/W
RθJB Junction-to-board thermal resistance 44.4 °C/W
ΨJT Junction-to-top characterization parameter 17.9 °C/W
ΨJB Junction-to-board characterization parameter 44.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Evaluated using JEDEC standard (2s2p).