JAJSEO3D June   2012  – February 2018 TPS81256

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     標準アプリケーション
    2.     効率と負荷電流との関係
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operation
      2. 8.3.2 Power-Save Mode
      3. 8.3.3 Current Limit Operation, Maximum Output Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Softstart, Enable
      2. 8.4.2 Load Disconnect and Reverse Current Protection
      3. 8.4.3 Undervoltage Lockout
      4. 8.4.4 Thermal Regulation
      5. 8.4.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection CEXT
        2. 9.2.2.2 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Surface Mount Information
    4. 11.4 Thermal and Reliability Information
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • SIP|9
サーマルパッド・メカニカル・データ
発注情報

11.2 Layout Example

TPS81256 land_pad_lvsai0.gifFigure 23. Recommended Land Pattern Image and Dimensions
SOLDER PAD DEFINITIONS(1)(2)(3)(4) COPPER PAD SOLDER MASK (5)
OPENING		 COPPER THICKNESS STENCIL (6)
OPENING 		STENCIL THICKNESS
Non-solder-mask defined (NSMD) 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick
(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control.