JAJSEO3D June   2012  – February 2018 TPS81256

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     標準アプリケーション
    2.     効率と負荷電流との関係
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operation
      2. 8.3.2 Power-Save Mode
      3. 8.3.3 Current Limit Operation, Maximum Output Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Softstart, Enable
      2. 8.4.2 Load Disconnect and Reverse Current Protection
      3. 8.4.3 Undervoltage Lockout
      4. 8.4.4 Thermal Regulation
      5. 8.4.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection CEXT
        2. 9.2.2.2 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Surface Mount Information
    4. 11.4 Thermal and Reliability Information
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • SIP|9
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage Voltage at VIN(2), VOUT(2), EN(2) –0.3 6 V
Input current Continuous average current into VIN(3) 1.05 A
Pulsed current into VIN(4) 1.3 A
Power dissipation Internally limited
Operating temperature, TA(3)(4)(5) –40 85 °C
Operating virtual junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) Limit the junction and the (top side) inductor case temperature to 110°C, limit the (top side) capacitor case temperature to 85°C for 2000h operation at maximum output power. Contact TI for more details on lifetime estimation.
(4) Limit the (top side) inductor case temperature to 140°C and the (top side) capacitor temperature to 115°C for 100h operation. Contact TI for more details on lifetime estimation.
(5) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 125°C, a maximum inductor case temperature of 125°C and a maximum capacitor case temperature of 85°C.