JAJSKS4A August 2021 – December 2021 TPS92519-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DEVICE | UNIT | |
---|---|---|---|
DAP (HTSSOP) | |||
32 | |||
RθJA | Junction-to-ambient thermal resistance(2)(3) | 26.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 16.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 8.3 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 8.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.8 | °C/W |