For related documentation, see the
following:
- Texas Instruments, Innovative DC/DC Power Modules selection guide
- Texas Instruments, Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™
QFN Package Technology white paper
- Texas Instruments, Benefits and Trade-offs of Various Power-Module Package
Options white paper
- Texas Instruments, Simplify Low EMI Design with Power Modules white
paper
- Texas Instruments, Power
Modules for Lab Instrumentation white paper
- Texas Instruments, An
Engineer's Guide To EMI In DC/DC Regulators e-book
- Texas Instruments, Soldering Considerations for Power Modules application
report
- Texas Instruments, Practical Thermal Design With DC/DC Power Modules
application report
- Texas Instruments, Using
New Thermal Metrics application report
- Texas Instruments, Thermal Design by Insight not Hindsight application
report
- Texas Instruments, A
Guide to Board Layout for Best Thermal Resistance for Exposed Pad
Packages application report
- Texas Instruments, Semiconductor and IC Package Thermal Metrics application
report
- Texas
Instruments, Thermal Design Made Simple with LM43603 and
LM43602 application report
- Texas Instruments, PowerPAD™ Thermally Enhanced Package
application report
- Texas Instruments, PowerPAD™ Made Easy application
report
- Texas Instruments, Using
New Thermal Metrics application report
- Texas Instruments, PCB Thermal Calculator
- Texas Instruments, Layout Guidelines for Switching Power Supplies
application report
- Texas Instruments, Simple Switcher PCB Layout Guidelines application
report
- Texas Instruments, Construction Your Power Supply- Layout Considerations
Seminar
- Texas Instruments, Low
Radiated EMI Layout Made Simple with LM4360x and LM4600x
application report
- Texas Instruments, TPSM365R6EVM User's Guide
- Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight
application report
- Optimizing Transient Response of Internally Compensated DC-DC
Converters with Feed forward Capacitor application
report