JAJSUQ8C June   2024  – September 2024 TPSM81033

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout
      2. 6.3.2 Enable and Soft Start
      3. 6.3.3 Setting the Output Voltage
      4. 6.3.4 Pass-Through Operation
      5. 6.3.5 Power Good Indicator
      6. 6.3.6 Implement Output Discharge by PG function
      7. 6.3.7 Overvoltage Protection
      8. 6.3.8 Output Short-to-Ground Protection
      9. 6.3.9 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power-Save Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting the Output Voltage
        2. 7.2.2.2 Output Capacitor Selection
        3. 7.2.2.3 Input Capacitor Selection
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 サード・パーティ製品に関する免責事項
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • VCD|9
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC (1) TPSM81033 TPSM81033 UNIT
VCD (QFN)- 9 PINS VCD (QFN)- 9 PINS
Standard EVM (2)
RθJA Junction-to-ambient thermal resistance 74.8 39.7 °C/W
RθJC Junction-to-case thermal resistance 36.6 NA °C/W
RθJB Junction-to-board thermal resistance 21.7 NA °C/W
ΨJT Junction-to-top characterization parameter 0.7 TBD °C/W
ΨJB Junction-to-board characterization parameter 21.1 19.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPSM81033EVM, 4-layer, 2oz copper NA PCB.