JAJSOO9A December   2022  – June 2024 TPSM82816

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precise Enable (EN)
      2. 7.3.2 Output Discharge
      3. 7.3.3 COMP/FSET
      4. 7.3.4 MODE/SYNC
      5. 7.3.5 Spread Spectrum Clocking (SSC)
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Power-Good Output (PG)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 Power Save Mode Operation (PSM)
      3. 7.4.3 100% Duty-Cycle Operation
      4. 7.4.4 Current Limit and Short-Circuit Protection
      5. 7.4.5 Soft Start / Tracking (SS/TR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Feedforward Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Voltage Tracking
      2. 8.3.2 Synchronizing to an External Clock
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Consideration
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • VCA|13
  • SIE|14
サーマルパッド・メカニカル・データ
発注情報

8.5.2.1 Thermal Consideration

The TPSM8281x module temperature must be kept less than the maximum rating of 125°C. The following are three basic approaches for enhancing thermal performance:

  • Improve the power dissipation capability of the PCB design
  • Improve the thermal coupling of the component to the PCB
  • Introduce airflow into the system

To estimate the approximate module temperature of the TPSM8281x, apply the typical efficiency stated in this data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by the thermal resistance. For more details on how to use the thermal parameters in real applications, see the application notes: Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.

The thermal values in Thermal Information used the recommended land pattern, shown at the end of this data sheet, including the vias as they are shown. The TPSM8281x was simulated on a PCB defined by JEDEC 51-7. For the SIE package, the vias on the GND pins were connected to copper on other PCB layers, while the remaining vias were not connected to other layers.