JAJSQP9A September   2024  – November 2024 TPSM82843

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Enable and Shutdown (EN)
      2. 7.3.2 Soft Start
      3. 7.3.3 VSET Pin: Output Voltage Selection
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Switch Current Limit, Short-Circuit Protection
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Output Voltage Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Save Mode Operation
      2. 7.4.2 100% Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPSM82843x
VCF (QFN-FCMOD)
7 PINS		 UNIT
RθJA Junction-to-ambient thermal resistance 72.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57.2 °C/W
RθJB Junction-to-board thermal resistance 21.2 °C/W
ψJT Junction-to-top characterization parameter (–4.2)(2) °C/W
ψJB Junction-to-board characterization parameter 21.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Case top temperature can be higher than temperature of active circuit because of inductor power dissipation. This results in a negative Junction-to-top characterization parameter.