JAJSQ56 November   2024 TPSM84338

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Fixed Frequency Peak Current Mode
      2. 6.3.2  Mode Selection
      3. 6.3.3  Voltage Reference
      4. 6.3.4  Output Voltage Setting
      5. 6.3.5  Switching Frequency Selection, Synchronization
      6. 6.3.6  Phase Shift
      7. 6.3.7  Enable and Adjusting Undervoltage Lockout
      8. 6.3.8  External Soft Start and Prebiased Soft Start
      9. 6.3.9  Power Good
      10. 6.3.10 Minimum On Time, Minimum Off Time, and Frequency Foldback
      11. 6.3.11 Frequency Spread Spectrum
      12. 6.3.12 Overvoltage Protection
      13. 6.3.13 Overcurrent and Undervoltage Protection
      14. 6.3.14 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes Overview
      2. 6.4.2 Heavy Load Operation
      3. 6.4.3 Pulse Frequency Modulation
      4. 6.4.4 Forced Continuous Conduction Modulation
      5. 6.4.5 Dropout Operation
      6. 6.4.6 Minimum On-Time Operation
      7. 6.4.7 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Custom Design With WEBENCH® Tools
        2. 7.1.2.2 Output Voltage Resistors Selection
        3. 7.1.2.3 Choosing Switching Frequency
        4. 7.1.2.4 Soft-Start Capacitor Selection
        5. 7.1.2.5 Output Capacitor Selection
        6. 7.1.2.6 Input Capacitor Selection
        7. 7.1.2.7 Feedforward Capacitor CFF Selection
        8. 7.1.2.8 Maximum Ambient Temperature
      3. 7.1.3 Application Curves
    2. 7.2 Best Design Practices
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 サード・パーティ製品に関する免責事項
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)TPSM84338UNIT
RCJ (QFN-FCMOD), 9 PINS
JEDEC(2)EVM(3)
RθJAJunction-to-ambient thermal resistance55.2N/A°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.1N/A°C/W
RθJBJunction-to-board thermal resistance16N/A°C/W
ΨJTJunction-to-top characterization parameterN/AN/A°C/W
ΨJBJunction-to-board characterization parameter15.7N/A°C/W
RθJA_EVMJunction-to-ambient thermal resistance on official EVM boardN/A46°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. These values do not represent the performance obtained in an actual application.
(3) The real RθJA is tested on TI EVM.