JAJSNJ7 March   2023 TRF0208-SEP

ADVANCE INFORMATION  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully-Differential Amplifier
      2. 7.3.2 Single Supply Operation
      3. 7.3.3 Power Down Option
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving a High-Speed ADC
      2. 8.1.2 Calculating Output Voltage Swing
      3. 8.1.3 Thermal Considerations
    2. 8.2 Typical Application
      1. 8.2.1 TRF0208-SEP in Receive Chain
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 TRF0208-SEP in Transmit Chain
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Drawings

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TRF0208-SEPUNIT
RZS (VQFN-FCRLF)
12 PINS
RθJA Junction-to-ambient thermal resistance66.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance64.3°C/W
RθJBJunction-to-board thermal resistance17.4°C/W
ΨJTJunction-to-top characterization parameter1.7°C/W
ΨJBJunction-to-board characterization parameter17.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.0°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.