SBOSAA3A
July 2024 – November 2024
TRF1108
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
AC-Coupled Configuration
6.3.2
DC-Coupled Configuration
6.4
Device Functional Modes
6.4.1
Power-Down Mode
7
Application and Implementation
7.1
Application Information
7.1.1
Thermal Considerations
7.2
Typical Application
7.2.1
RF DAC Buffer Amplifier
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curve
7.3
Power Supply Recommendations
7.3.1
Single-Supply Operation
7.3.2
Dual-Supply Operation
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ(パッケージ|ピン)
RPV|12
サーマルパッド・メカニカル・データ
発注情報
sbosaa3a_oa
8.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.