SLWS245B May   2014  – February 2017 TRF3722

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Typical Characteristics
      1. 6.6.1 Modulator Output Spectrum
    7. 6.7  Typical Characteristics - Output Power
    8. 6.8  Typical Characteristics - Gain
    9. 6.9  Typical Characteristics - OIP3
    10. 6.10 Typical Characteristics - OIP2
    11. 6.11 Typical Characteristics - OP1dB
    12. 6.12 Typical Characteristics - Noise
    13. 6.13 Typical Characteristics - Unadjusted CF
    14. 6.14 Typical Characteristics - Unadjusted SBS
    15. 6.15 Typical Characteristics - LO Harmonic
    16. 6.16 Typical Characteristics - BB Harmonic
    17. 6.17 Typical Characteristics - RF Output Return Loss
    18. 6.18 Typical Characteristics - PLL/VCO
    19. 6.19 Typical Characteristics - Current Consumption
    20. 6.20 Typical Characteristics - Power Dissipation
  7. 7 Parameter Measurement Information
    1. 7.1 Serial Interface Timing Diagram
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 RF Output
      2. 8.3.2 Baseband Inputs
      3. 8.3.3 LO Output
      4. 8.3.4 PLL Architecture
      5. 8.3.5 External VCO
      6. 8.3.6 Loop Filter
      7. 8.3.7 Lock Detect
    4. 8.4 Device Functional Modes
      1. 8.4.1 Selecting PLL Divider Values
      2. 8.4.2 Setup Example for Integer Mode
      3. 8.4.3 Integer and Fractional Mode Selection
      4. 8.4.4 Selecting the VCO and VCO Frequency Control
    5. 8.5 Register Maps
      1. 8.5.1 Serial interface Register Definition
        1. 8.5.1.1 BIAS SETTINGS
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures: DAC to Modulator Interface Network
      3. 9.2.3 Application Curves: DAC34H84 with TRF3722 Modulator Performance
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Layout

11.1 Layout Guidelines

Layout of the application board significantly impacts the analog performance of the TRF3722 device. Noise and high-speed signals should be prevented from leaking onto power-supply terminals or analog signals. The TRF3722 device is fitted with a ground slug on the back of the package that must be soldered to the printed circuit board (PCB) ground with adequate ground vias to ensure a good thermal and electrical connection. The ground pins of the device can be directly tied to the ground slug pad for a low-inductance path to ground. Additional ground vias may be added if space allows. Follow these recommendations:

  • Place supply decoupling capacitors physically close to the device, on the same side of the board. Isolate supply terminals with a ferrite bead.
  • Maintain a continuous ground plane in the vicinity of the device and as return paths for all high-speed signal lines. Place reference plane vias or decoupling capacitors near any signal line reference transition.
  • Power planes should not overlap each other or high-speed signal lines.
  • Isolate REFIN routing from loop filter lines, control lines, and other high-speed lines.

11.2 Layout Example

TRF3722 Layout_slws245.gif Figure 139. Layout