JAJSUZ7 July   2024 TRS213E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Characteristics
    5. 5.5 Electrical Characteristics, Power and Status
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Characteristics

THERMAL METRIC(1) DB (SSOP) UNIT
28 PINS
RΘJA Junction-to-ambient thermal resistance 66.1 ℃/W
RΘJC(top) Junction-to-case (top) thermal resistance 33.2 ℃/W
RΘJB Junction-to-board thermal resistance 37.0 ℃/W
ΨJT Junction-to-top characterization parameter 4.6 ℃/W
ΨJB Junction-to-board characterization parameter 36.5 ℃/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.