JAJSGT5K
November 2006 – July 2024
TS3USB221
PRODUCTION DATA
1
1
特長
2
アプリケーション
3
概要
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Dynamic Electrical Characteristics, VCC = 3.3V ± 10%
5.7
Dynamic Electrical Characteristics, VCC = 2.5V ± 10%
5.8
Switching Characteristics, VCC = 3.3V ± 10%
5.9
Switching Characteristics, VCC = 2.5V ± 10%
5.10
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Low Power Mode
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
ドキュメントの更新通知を受け取る方法
9.3
サポート・リソース
9.4
Trademarks
9.5
静電気放電に関する注意事項
9.6
用語集
10
Revision History
11
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
RSE|10
MPQF186D
DRC|10
MPDS117L
サーマルパッド・メカニカル・データ
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
±1500
V
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.