JAJSVJ1 October   2024 TSD12C-Q1 , TSD15C-Q1 , TSD18C-Q1 , TSD24C-Q1 , TSD36C-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings—IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12C-Q1
    8. 5.8  Electrical Characteristics - TSD15C-Q1
    9. 5.9  Electrical Characteristics - TSD18C-Q1
    10. 5.10 Electrical Characteristics - TSD24C-Q1
    11. 5.11 Electrical Characteristics - TSD36C-Q1
    12. 5.12 Typical Characteristics
  7. Application and Implementation
  8. Application Information
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
Parameter DEVICE MIN MAX UNIT
PPP   IEC 61000-4-5 (tp 8/20µs) Peak Pulse Power at 25°C TSD12C-Q1 390 W
TSD15C-Q1
TSD18C-Q1
TSD24C-Q1
TSD36C-Q1 400 W
IPP IEC 61000-4-5 (tp 8/20µs) Peak Pulse Current at 25°C TSD12C-Q1 15 A
TSD15C-Q1 12 A
TSD18C-Q1
TSD24C-Q1 9 A
TSD36C-Q1 6.5 A
TA Ambient Operating Temperature -55 150 °C
Tstg Storage Temperature -65 155 °C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.