JAJSSZ7 February   2024 TUSB211A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Speed EQ
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low-Speed (LS) Mode
      2. 6.4.2 Full-Speed (FS) Mode
      3. 6.4.3 High-Speed (HS) Mode
      4. 6.4.4 High-Speed Downstream Port Electrical Compliance Test Mode
      5. 6.4.5 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Test Procedure to Construct USB High-Speed Eye Diagram
          1. 7.2.2.1.1 For a Host Side Application
          2. 7.2.2.1.2 For a Device Side Application
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RWB|12
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC (1) RWB (X2QFN) UNIT
12 PINS
RθJA Junction-to-ambient thermal resistance 137.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62 °C/W
RθJB Junction-to-board thermal resistance 67.2 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 67.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.