JAJSG68A September   2018  – December 2018 TUSB217-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High speed boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) mode
      2. 7.4.2 Full Speed (FS) mode
      3. 7.4.3 High Speed (HS) mode
      4. 7.4.4 High Speed downstream port electrical compliance test mode
      5. 7.4.5 Shutdown mode
      6. 7.4.6 I2C mode
    5. 7.5 TUSB217 Registers
      1. 7.5.1 EDGE_BOOST Register (Offset = 0x1) [reset = X]
        1. Table 4. EDGE_BOOST Register Field Descriptions
      2. 7.5.2 CONFIGURATION Register (Offset = 0x3) [reset = X]
        1. Table 5. CONFIGURATION Register Field Descriptions
      3. 7.5.3 DC_BOOST Register (Offset = 0xE) [reset = X]
        1. Table 6. DC_BOOST Register Field Descriptions
      4. 7.5.4 RX_SEN Register (Offset = 0x25) [reset = X]
        1. Table 7. RX_SEN Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RGY|14
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

Although the land pattern has matched trace width to pad width, optimal impedance control is based on the user's own PCB stack-up. The recommendation is to maintain 90 Ω differential routing underneath the device.

All dimensions are in millimetres (mm).