JAJSNA2A May 2024 – September 2024 TUSB564-Q1
PRODUCTION DATA
THERMAL METRIC(1) | Device | UNIT | |
---|---|---|---|
RGF (VQFN) | |||
40 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 29.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 10.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 10.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.5 | °C/W |