JAJSEM6J April   2006  – October 2020 TXB0104

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.2 V
    7. 6.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCCA = 1.2 V
    12. 6.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    17. 6.17 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|14
  • RGY|14
  • RUT|12
  • NMN|12
  • YZT|12
  • PW|14
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision I (March 2018) to Revision J (October 2020)

  • 文書全体にわたって表、図、相互参照の採番方法を更新Go
  • Added NMN Package, 12-Pin NFBGA pinout drawing in Pin Configuration and Functions sectionGo

Changes from Revision H (January 2018) to Revision I (March 2018)

  • Updated Pin Functions table Go
  • Added Pin Assignments table for YZT package Go
  • Added Pin Assignments table for GXU and ZXU package Go
  • Updated Layout Example Go

Changes from Revision G (November 2014) to Revision H (January 2018)

  • Added Package, families to Package, pinout drawings in Pin Configuration and Functions section Go
  • Added junction temperature range in Absolute Maximum RatingstableGo
  • Changed unit from V to kV in ESD Ratings tableGo

Changes from Revision F (May 2012) to Revision G (November 2014)

  • 「ピン構成および機能」セクション、「取り扱いに関する定格」の表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加 Go