JAJSF74A August   2009  – April 2018 TXB0106-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
    1.     代表的な動作回路
  3. 概要
    1.     Device Images
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements – VCCA = 1.2 V, TA = 25°C
    7. 6.7  Timing Requirements – VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements – VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements – VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements – VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics –VCCA = 1.2 V, TA = 25°C
    12. 6.12 Switching Characteristics – VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics – VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics – VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics – VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Output Load Considerations
      5. 8.3.5 Enable and Disable
      6. 8.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended.

  • Bypass capacitors should be used on power supplies, and should be placed as close as possible to the VCCA and VCCB pins and the GND pin
  • Short trace-lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the O.S. duration, approximately 10 ns, ensuring that any reflection encounters low impedance at the source driver.