JAJSH60A april   2019  – december 2020 UC1825B-SP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Methods
      2. 7.3.2 Synchronization
      3. 7.3.3 High Current Outputs
      4. 7.3.4 Open Loop Test Circuit
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 System Design Theory
        1. 8.2.1.1 Switching Frequency
        2. 8.2.1.2 Transformer
        3. 8.2.1.3 RCD and Diode Clamp
        4. 8.2.1.4 Output Diode
        5. 8.2.1.5 Main Switching MOSFETs
        6. 8.2.1.6 Output Filter and Capacitance
        7. 8.2.1.7 Compensation
        8. 8.2.1.8 Sense Resistor
    3. 8.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
      5. 10.1.5 Ground Planes
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) UC1825B-SP UNIT
HKT (CFP)
16 PINS
RθJA Junction-to-ambient thermal resistance 32.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 13.8 °C/W
RθJB Junction-to-board thermal resistance 15.2 °C/W
ψJT Junction-to-top characterization parameter 7 °C/W
ψJB Junction-to-board characterization parameter 14.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.