JAJSCB0F June   2016  – November 2024 UCC21520

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. 概要 (続き)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Propagation Delay and Pulse Width Distortion
    2. 7.2 Rising and Falling Time
    3. 7.3 Input and Disable Response Time
    4. 7.4 Programable Dead Time
    5. 7.5 Power-up UVLO Delay to OUTPUT
    6. 7.6 CMTI Testing
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD, VCCI, and Undervoltage Lock Out (UVLO)
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Diode Structure in the UCC21520 and the UCC21520A
    4. 8.4 Device Functional Modes
      1. 8.4.1 Disable Pin
      2. 8.4.2 Programmable Dead-Time (DT) Pin
        1. 8.4.2.1 Tying the DT Pin to VCC
        2. 8.4.2.2 DT Pin Connected to a Programming Resistor Between DT and GND Pins
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing INA/INB Input Filter
        2. 9.2.2.2 Select External Bootstrap Diode and its Series Resistor
        3. 9.2.2.3 Gate Driver Output Resistor
        4. 9.2.2.4 Gate to Source Resistor Selection
        5. 9.2.2.5 Estimate Gate Driver Power Loss
        6. 9.2.2.6 Estimating Junction Temperature
        7. 9.2.2.7 Selecting VCCI, VDDA/B Capacitor
          1. 9.2.2.7.1 Selecting a VCCI Capacitor
          2. 9.2.2.7.2 Selecting a VDDA (Bootstrap) Capacitor
          3. 9.2.2.7.3 Select a VDDB Capacitor
        8. 9.2.2.8 Dead Time Setting Guidelines
        9. 9.2.2.9 Application Circuits with Output Stage Negative Bias
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 サード・パーティ製品に関する免責事項
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Certifications
    4. 12.4 ドキュメントの更新通知を受け取る方法
    5. 12.5 サポート・リソース
    6. 12.6 Trademarks
    7. 12.7 静電気放電に関する注意事項
    8. 12.8 用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from Revision E (December 2021) to Revision F (November 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • 「特長」セクションから 5ns の最大遅延マッチングを削除Go
  • 伝搬遅延の標準値を 19ns から 33ns に変更Go
  • 10ns の最小パルス幅を 20ns に変更Go
  • 動作温度範囲を接合部温度範囲に変更Go
  • CMTI 仕様を 100V/ns から 125V/ns に変更Go
  • サージ耐性の値を 12.8kV から 10kV に変更Go
  • 絶縁バリアの寿命 40 年超の箇条書き項目を削除Go
  • 「5ns 未満の入力パルスとノイズ過渡を除去」を削除Go
  • 安全認証を最新の規格に更新Go
  • CSA 認証を削除Go
  • 新しい仕様値に合わせて「概要」セクションを更新Go
  • Updated DT pin description to recommend ≤1nF capacitor on DT pinGo
  • Changed DT pin Min resistor recommendations from 500Ω to 2kΩGo
  • Updated ESD spec from HBM = ±4000 and CDM = ±1500 to HBM = ±2000 and CDM = ±1000 to match ESD industry standardsGo
  • Deleted ambient temperature specGo
  • Changed Max junction temp to 150CGo
  • Updated values from RθJA = 67.3°C/W, RθJC(top) = 34.4°C/W, RθJB = 32.1°C/W, ψJT = 18°C/W, ψJB = 31.6°C/W to RθJA = 69.8°C/W, RθJC(top) = 33.1°C/W, RθJB = 36.9°C/W, ψJT = 22.2°C/W, ψJB = 36°C/WGo
  • Updated values from PD = 1.05W, PDI = 0.05W, PDA/PDB = 0.5W to PD = 950mW, PDI = 50mW, PDA/PDB = 450mWGo
  • Updated values from DTI = 21mm, VIOSM = 8000VPK to DTI = 17mm, VIOSM = 10000VPK and added VIMP = 7692VPKGo
  • Deleted safety related certifications sectionGo
  • Updated values from IS = 75mA/36mA, PS = 50mW/900mW/900mW/1850mW to IS = 58mA/34mA, PS = 50mW/870mW/870mW/1790mWGo
  • Changed test condition from VDDA=VDDB=12V to VDDA=VDDB=15VGo
  • Updated IVCCI quiescent current spec 1.4mA typical value to 1.5mA typicalGo
  • Updated IVDDA/IVDDB quiescent current spec Max value from 1.8mA to 2.5mAGo
  • Updated IVCCI operating current Typ value from 2.0mA to 3.0mA and added Max value 3.5mAGo
  • Added IVDDA/IVDDB operating current Max = 4.2mAGo
  • Updated values from Rising threshold Min = 8.3V, Typ = 8.7V, Max = 9.2V to Min = 7.7V, Typ = 8.5V, Max = 8.9VGo
  • Updated values from Falling threshold Min = 7.8V, Typ = 8.2V, Max = 8.7V to Min = 7.2V, Typ = 7.9V, Max = 8.4VGo
  • Updated 8-V UVLO hysteresis typ = 0.5V to 0.6VGo
  • Updated Input high threshold Min value from 1.6V to 1.2VGo
  • Changed output voltage at high state spec from 11.95V Typ to 14.95V Typ. Changed test condition from VDDA=VDDB=15V to VDDA=VDDB=12V. Go
  • Deleted Dead time parameter from Electrical Characteristics and added new Timing RequirementsGo
  • Changed propagation delay TPDHL and TPDLH from Min=14ns, Typ = 19ns, Max = 30ns to Min=26ns. Typ = 33ns, Max = 45nsGo
  • Changed propagation delay matching from Max = 5ns to Max = 6.5ns from TJ = -40C to -10C and Max = 5ns from TJ = -10C to 150CGo
  • Added VCCI power up delayGo
  • Updated VDDA/VDDB power-up delay from Max = 100us to 10usGo
  • Updated CMTI from Min = 100V/ns to 125V/nsGo
  • Updated insulation and thermal curves to match updated characteristicsGo
  • Updated typical characteristics figuresGo
  • Updated Power-up UVLO Delay to OUTPUT section to match device electrical characteristics Go
  • Changed the Functional Block Diagram to add deglitch filter blockGo
  • Changed DISABLE logic; DISABLE left open will pull outputs lowGo
  • Added paragraph on minimum pulse width to Output Stage sectionGo
  • Updated ESD diode structureGo
  • Updated DT Pin Connected to a Programming Resistor Between DT and GND Pins section to recommend <=1nF capacitor on DT pin. Go
  • Updated typical schematic DT pin capacitor recommendation Go
  • Updated Dead Time Setting Guidelines section to recommend <=1nF capacitor on DT pin. Go

Changes from Revision D (March 2020) to Revision E (December 2021)

Changes from Revision C (December 2019) to Revision D (March 2020)

  • Changed DT pin descriptionGo
  • Changed DT pin configuration recommendations Go
  • Added update to bootstrap circuit recommendationsGo
  • Added update to gate resistor selection recommendations Go
  • Added gate to source resistor recommendation Go
  • Added update to Cboot selection recommendations Go