SLUSAT7G November   2011  – July 2024 UCC27211

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Level Shift
      4. 6.3.4 Boot Diode
      5. 6.3.5 Output Stages
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Threshold Type
        2. 7.2.2.2 VDD Bias Supply Voltage
        3. 7.2.2.3 Peak Source and Sink Currents
        4. 7.2.2.4 Propagation Delay
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Revision History

Changes from Revision F (November 2014) to Revision G (July 2024)

  • Changed document title to reflect key features of the device. Go
  • Updated several specifications to reflect the device characteristics.Go
  • Deleted all references to UCC27210 since device is obsolete.Go
  • Changed Features section: 1) Changed junction temperature range specification from -40°C to 140°C to -40°C to 150°C. 2) Changed peak currents to reflect specification, no change in actual drive strength (from 4A/4A to 3.7A/4.5A. 3) Deleted 0.9-Ω Pullup and Pulldown Resistance since it is not specified in the Electrical Characteristics. 4) Deleted Pseudo-CMOS Compatible Input which is not a feature of the UCC27211A device. 5) Changed typical specifications mentioned for delay matching and propagation delay to reflect the information in the Electrical Characteristics table: from 2-ns delay matching, 18-ns propagation delay to 4-ns delay matching, 20-ns propagation delay. Go
  • Updated Applications section with list of top 5 typical applications.Go
  • Changed Description section: 1) Changed peak current to display typical pull-up/pull-down, no change in actual specification - from 4A4/A to 3.7A/4.5A. 2) Deleted pullup/pulldown resistance information since this is not an actual specification in the Electrical Characteristics table. 3) Changed HS transient tolerance to match the specification in the Absolute Maximum table - from -18V to -(VDD-24)V. 4) Changed delay matching to match specification in the Electrical Characteristics table - from 2ns to 4ns. Go
  • Updated Absolute Maximum Ratings section to remove "Lead temperature (soldering, 10s)". Go
  • Updated Recommended Operating Conditions: Operating Junction Temperature maximum changed from 140°C to 150°C.Go
  • Updated Thermal Information section to reflect device characteristics. Go
  • Removed specifications with test condition "DDA only" since all specifications apply to all package variants.Go
  • Removed specifications for UCC27210. Go
  • Updated Supply Currents specifications in the Electrical Characteristics table: 1) IDD minimum specification removed. 2) IDD typical changed (From: 0.085mA. To: 0.11mA). 3) IDDO typical changed (From: 2.5mA. To: 1.4mA). 4) IDDO maximum changed (From: 5.2mA. To: 3mA. 5) IHB minimum specification removed. 6) IHBO typical changed (From: 2.5mA. To: 1.3mA). 7) IHBO maximum changed (From: 5mA. To: 3mA). 8) IHBS test condition changed to match VHS maximum recommended operating conditions (From: 115V. To: 105V). 9) IHBSO typical changed (From: 0.07mA. To: 0.03mA). 10) IHBSO maximum changed (From: 1.2mA. To: 1mA). Go
  • Updated Input specifications in the Electrical Characteristics table: UCC27211 VLIT minimum changed (From: 1.3V. To: 1.2V). Go
  • Updated Bootstrap diode specifications in the Electrical Characteristics table: 1) VF maximum changed (From: 0.8V. To: 0.85V). 2) VFI typical changed (From: 0.85V. To: 0.9V), and maximum changed (From: 0.95V. To: 1.05V). 3) RD test conditions changed (From: 100mA and 80mA. To: 180mA and 160mA). 4) RD typical changed (From: 0.5Ω. To: 0.55Ω). Go
  • Updated LO/HO Gate Driver specifications in the Electrical Characteristics table: 1) Minimum specification removed for VLOL, VLOH, VHOL, VHOH. 2) VLOL and VHOL typical changed (From 0.09V. To 0.07V). 3) VLOH and VHOH typical changed (From: 0.16V. To: 0.11V).Go
  • Updated Switching Characteristics - Propagation Delays table: 1) Changed TDLFF and TDHFF typicals (From: 17ns. To: 19ns). 2) Changed TDLRR and TDHRR typicals (From: 18ns. To: 20ns). Go
  • Updated Switching Characteristics - Delay Matching table: 1) Changed TMON and TMOFF typicals (From: 2ns. To: 4ns). 2) Changed TMON and TMOFF across temperature maximum (From: 14ns. To: 17ns).Go
  • Updated Switching Characteristis - Output Rise and Fall Time table: 1) tR typical changed (From: 0.36us. To: 0.27us). 2) tF typical changed (From: 0.15us. To: 0.16us). Go
  • Updated Switching Characteristics - Miscellaneous table: tIN_PW maximum changed (From: 50ns. To: 40ns).Go
  • Updated all plots in Typical Characteristics section to reflect the typical specification of the device. Go
  • Updated Input Stages section to match the input pulldown resistance typical specification in the Electrical Characteristics table, changed from 70kΩ to 68kΩ. Changed input capacitance from 2pF to 4pF. Go
  • Changed application curves to display propagation delay and rise/fall time plots. Go

Changes from Revision E (August 2013) to Revision F (November 2014)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go