over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
MAX |
UNIT |
Supply voltage |
VDD |
–0.3 |
20 |
V |
OUTA, OUTB
voltage |
DC |
–0.3 |
VDD + 0.3 |
V |
Repetitive pulse < 200 ns(4) |
–2 |
VDD + 0.3 |
V |
Output continuous source/sink
current |
IOUT_DC |
|
0.3 |
A |
Output pulsed source/sink current
(0.5 µs) |
IOUT_pulsed |
|
5 |
A |
INA, INB, ENA, ENB
voltage(3) |
–5 |
20 |
V |
Operating virtual junction
temperature, TJ |
–40 |
150 |
°C |
Storage
temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum
Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or
any other conditions beyond those indicated under Recommended Operating
Conditions. Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted.
Currents are positive into, negative out of the specified terminal. See
Packaging Section of the datasheet for thermal limitations and considerations of
packages.
(3) The maximum voltage on the Input and Enable pins is not
restricted by the voltage on the VDD pin.
(4) Values are verified by characterization on bench.