SLUSAQ3H November   2011  – June 2024 UCC27523 , UCC27525 , UCC27526

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Enable Function
      5. 7.3.5 Output Stage
      6. 7.3.6 Low Propagation Delays and Tightly Matched Outputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input-to-Output Logic
        2. 8.2.2.2 Enable and Disable Function
        3. 8.2.2.3 VDD Bias Supply Voltage
        4. 8.2.2.4 Propagation Delay
        5. 8.2.2.5 Drive Current and Power Dissipation
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) UCC27523/5 UCC27523/5/6 UNIT
SOIC (D) MSOP (DGN) WSON (DSD)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 130.9 71.8 46.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 80 65.6 46.7
RθJB Junction-to-board thermal resistance 71.4 7.4 22.4
ψJT Junction-to-top characterization parameter 21.9 7.4 0.7
ψJB Junction-to-board characterization parameter 70.9 31.5 22.6
RθJC(bot) Junction-to-case (bottom) thermal resistance – 19.6 9.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.