JAJSDC3A June   2017  – August 2018 UCC27712

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      標準的な伝播遅延の比較
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dynamic Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD and Under Voltage Lockout
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Level Shift
      6. 8.3.6 Low Propagation Delays and Tightly Matched Outputs
      7. 8.3.7 Parasitic Diode Structure
    4. 8.4 Device Functional Modes
      1. 8.4.1 Minimum Input Pulse Operation
      2. 8.4.2 Output Interlock and Dead Time
      3. 8.4.3 Operation Under 100% Duty Cycle Condition
      4. 8.4.4 Operation Under Negative HS Voltage Condition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
        2. 9.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
        3. 9.2.2.3 Selecting VDD Bypass/Holdup Capacitor (CVDD) and Rbias
        4. 9.2.2.4 Selecting Bootstrap Resistor (RBOOT)
        5. 9.2.2.5 Selecting Gate Resistor RON/ROFF
        6. 9.2.2.6 Selecting Bootstrap Diode
        7. 9.2.2.7 Estimate the UCC27712 Power Losses (PUCC27712)
        8. 9.2.2.8 Estimating Junction Temperature
        9. 9.2.2.9 Operation With IGBT's
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted). All voltages are with respect to COM (unless otherwise noted), currents are positive into and negative out of the specified terminal.(1)(2)
PARAMETER MIN MAX UNIT
Input voltage HI, LI(3)(4) –5 24 V
VDD supply voltage(4) –0.3 24
HB –0.3 700
HB–HS(4) –0.3 24
Output voltage HO DC HS–0.3 HB+0.3 V
Transient, less than 100 ns(5) HS–2 HB+0.3
LO DC –0.3 VDD+0.3 V
Transient, less than 100 ns(5) –2 VDD+0.3
Output current HO, LO IOUT_PULSED (100 ns) 2.8/–1.8 A
IOUT_DC 0.15
dVHS/dt Allowable offset supply voltage transient –50 50 V/ns
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) The maximum voltage on the input pins is not restricted by the voltage on the VDD pin.
(4) Ambient temperature ( TA ) ≥ 25°C.
(5) Values are verified by characterization on bench.