SLUSFZ0 November   2024 UCC33411-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specifications
    6. 6.6 Safety-Related Certifications
    7. 6.7 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Disable
      2. 7.3.2 Output Voltage Soft-Start
      3. 7.3.3 Output Voltage Steady-State Regulation
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout
        2. 7.3.4.2 Output Under-Voltage Protection
        3. 7.3.4.3 Output Over-Voltage Protection
        4. 7.3.4.4 Over-Temperature Protection
        5. 7.3.4.5 Fault Reporting and Auto-Restart
      5. 7.3.5 VCC Load Recommended Operating Area
      6. 7.3.6 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical and Packaging Information
    1. 13.1 Mechanical Data

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発注情報

11.6 Electrostatic Discharge Caution

UCC33411-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.