JAJSG98K June   2001  – November 2023 UCC27323 , UCC27324 , UCC27325 , UCC37323 , UCC37324 , UCC37325

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source/Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Parallel Outputs
        3. 8.2.2.3 VDD
        4. 8.2.2.4 Driver Current and Power Requirements
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 サード・パーティ製品に関する免責事項
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Device Comparison Table

OUTPUT CONFIGURATION TEMPERATURE
RANGE
TA = TJ		 PACKAGED DEVICES(1)
SOIC-8 (D) MSOP-8 PowerPAD (DGN)(2) PDIP-8 (P)
Dual inverting –40°C to +125°C UCC27323D UCC27323DGN UCC27323P
0°C to +70°C UCC37323D UCC37323DGN UCC37323P
Dual noninverting –40°C to +125°C UCC27324D UCC27324DGN UCC27324P
0°C to +70°C UCC37324D UCC37324DGN UCC37324P
One inverting, one noninverting –40°C to +125°C UCC27325D UCC27325DGN UCC27325P
0°C to +70°C UCC37325D UCC37325DGN UCC37325P
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (for example UCC27323DR, UCC27324DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD is not directly connected to any leads of the package. However, the PowerPAD is electrically and thermally connected to the substrate which is the ground of the device.