JAJSKM1C october   2019  – september 2021 UCC5870-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Electrical Characteristics
    8. 6.8  SPI Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
        1. 7.3.1.1 VCC1
        2. 7.3.1.2 VCC2
        3. 7.3.1.3 VEE2
        4. 7.3.1.4 VREG1
        5. 7.3.1.5 VREG2
        6. 7.3.1.6 VREF
        7. 7.3.1.7 Other Internal Rails
      2. 7.3.2 Driver Stage
      3. 7.3.3 Integrated ADC for Front-End Analog (FEA) Signal Processing
        1. 7.3.3.1 AI* Setup
        2. 7.3.3.2 ADC Setup and Sampling Modes
          1. 7.3.3.2.1 Center Sampling Mode
          2. 7.3.3.2.2 Edge Sampling Mode
          3. 7.3.3.2.3 Hybrid Mode
        3. 7.3.3.3 DOUT Functionality
      4. 7.3.4 Fault and Warning Classification
      5. 7.3.5 Diagnostic Features
        1. 7.3.5.1  Undervoltage Lockout (UVLO) and Overvoltage Lockout (OVLO)
          1. 7.3.5.1.1 Built-In Self Test (BIST)
            1. 7.3.5.1.1.1 Analog Built-In Self Test (ABIST)
            2. 7.3.5.1.1.2 Function BIST
            3. 7.3.5.1.1.3 Clock Monitor
              1. 7.3.5.1.1.3.1 Clock Monitor Built-In Self Test
        2. 7.3.5.2  CLAMP, OUTH, and OUTL Clamping Circuits
        3. 7.3.5.3  Active Miller Clamp
        4. 7.3.5.4  DESAT based Short Circuit Protection (DESAT)
        5. 7.3.5.5  Shunt Resistor based Overcurrent Protection (OCP) and Short Circuit Protection (SCP)
        6. 7.3.5.6  Temperature Monitoring and Protection for the Power Transistors
        7. 7.3.5.7  Active High Voltage Clamping (VCECLP)
        8. 7.3.5.8  Two-Level Turn-Off
        9. 7.3.5.9  Soft Turn-Off (STO)
        10. 7.3.5.10 Thermal Shutdown (TSD) and Temperature Warning (TWN) of Driver IC
        11. 7.3.5.11 Active Short Circuit Support (ASC)
        12. 7.3.5.12 Shoot-Through Protection (STP)
        13. 7.3.5.13 Gate Voltage Monitoring and Status Feedback
        14. 7.3.5.14 VGTH Monitor
        15. 7.3.5.15 Cyclic Redundancy Check (CRC)
          1. 7.3.5.15.1 Calculating CRC
        16. 7.3.5.16 Configuration Data CRC
        17. 7.3.5.17 SPI Transfer Write/Read CRC
          1. 7.3.5.17.1 SDI CRC Check
          2. 7.3.5.17.2 SDO CRC Check
        18. 7.3.5.18 TRIM CRC Check
    4. 7.4 Device Functional Modes
      1. 7.4.1 State 1: RESET
      2. 7.4.2 State 2: Configuration 1
      3. 7.4.3 State 3: Configuration 2
      4. 7.4.4 State 4: Active
    5. 7.5 Programming
      1. 7.5.1 SPI Communication
        1. 7.5.1.1 System Configuration of SPI Communication
          1. 7.5.1.1.1 Independent Slave Configuration
          2. 7.5.1.1.2 Daisy Chain Configuration
          3. 7.5.1.1.3 Address-based Configuration
        2. 7.5.1.2 SPI Data Frame
          1. 7.5.1.2.1 Writing a Register
          2. 7.5.1.2.2 Reading a Register
    6. 7.6 Register Maps
      1. 7.6.1 UCC5870 Registers
  9. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Dissipation Considerations
      2. 8.1.2 Device Addressing
    2. 8.2 Typical Application Using Internal ADC Reference and Power FET Sense Current Monitoring
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VCC1, VCC2, and VEE2 Bypass Capacitors
        2. 8.2.2.2 VREF, VREG1, and VREG2 Bypass Capacitors
        3. 8.2.2.3 Bootstrap Capacitor (VBST)
        4. 8.2.2.4 VCECLP Input
        5. 8.2.2.5 External CLAMP Output
        6. 8.2.2.6 AI* Inputs
        7. 8.2.2.7 OUTH/ OUTL Outputs
        8. 8.2.2.8 nFLT* Outputs
      3. 8.2.3 Application Curves
    3. 8.3 Typical Application Using DESAT Power FET Monitoring
      1. 8.3.1 Detailed Design Procedure
        1. 8.3.1.1 DESAT Input
      2. 8.3.2 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 VCC1 Power Supply
    2. 9.2 VCC2 Power Supply
    3. 9.3 VEE2 Power Supply
    4. 9.4 VREF Supply (Optional)
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Component Placement
      2. 10.1.2 Grounding Considerations
      3. 10.1.3 High-Voltage Considerations
      4. 10.1.4 Thermal Considerations
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-20200608-SS0I-DXF0-DG42-K3WDGW44HGXK-low.gif Figure 5-1 (DWJ)36-Pin SOICTop View
Table 5-1 Pin Functions
PIN I/O(1) DESCRIPTION
NO. NAME
1 GND1 G Primary Side Ground. Connect all GND1 pins together and to the PCB ground plane on the primary side.
2 NC — No internal connection. Connect to GND1.
3 NC — No internal connection. Connect to GND1.
4 NC — No internal connection. Connect to GND1.
5 NC — No internal connection. Connect to GND1.
6 ASC_EN I Active Short Circuit Enable Input. ASC_EN enables the ASC function and forces the output of the driver to the state defined by the ASC input. If ASC is high, OUTH is pulled high. If ASC is low, OUTL is pulled low. See the Active Short Circuit (ASC) section for additional details.
7 nFLT1 O Fault Indicator Output 1. nFLT1 is used to interrupt the host when a fault occurs. Faults that are unmasked pull nFLT1 low when the fault occurs. nFLT1 is high when all faults are either non-existent or masked. See the Fault and Warning Classification section for additional details.
8 nFLT2/DOUT O Fault Indicator Output 2. nFLT2 is used to interrupt the host when a fault occurs. Additionally, nFLT2 may be configured as DOUT to provide the host controller a PWM signal with a duty cycle relative to the ADC input of interest. Faults that are unmasked pull nFLT2 low when the fault occurs. nFLT2 is high when all faults are either non-existent or masked. See the Fault and Warning Classification or DOUT Functionality section for additional details.
9 VCC1 P Primary Side Power Supply. Connect a 3V to 5.5V power supply to VCC1. Bypass VCC1 to GND1 with ceramic bulk capacitance as close to the VCC1 pin as possible. See the VCC1, VCC2, VEE2 Bypass Capacitors section for more details on selecting the values.
10 ASC I Active Short Circuit Control Input. ASC sets the drive state when ASC_EN is high. If ASC is high, OUTH is pulled high. If ASC is low, OUTL is pulled low. See the Active Short Circuit Support (ASC) section for additional details.
11 IN– I Negative PWM Input. IN- is connected to the IN+ from the opposite arm of the half-bridge. If IN+ and IN- overlap, the Shoot Through Protection (STP) fault is asserted. See the Shoot-Through Protection section for additional details.
12 IN+ I Positive PWM Input. IN+ drives the state of the driver output. With the driver enabled, when IN+ is high, OUTH is pulled high. When IN+ is low, OUTL is pulled low. Drive IN+ with a 1kHz to 50kHz PWM signal, with a logic level determined by the VCC1 voltage. IN+ is connected to the IN- of the opposite arm of the half-bridge. If IN+ and IN- overlap, the Shoot Through Protection (STP) fault is asserted. See the Shoot-Through Protection section for additional details.
13 CLK I SPI Clock. CLK is the clock signal for the main SPI interface. The SPI interface operates with clock rates up to 4MHz. See the SPI Communication section for more details.
14 nCS I SPI Chip Selection Input. nCS is an active low input used to activate the SPI slave device. Drive nCS low during SPI communication. When nCS is high, the CLK and SDI inputs are ignored. See the SPI Communication section for more details.
15 SDI I SPI Data Input. SDI is the data input for the main SPI interface. Data is sampled on the falling edge of CLK, SDI must be in a stable condition to ensure proper communication. See the SPI Communication section for more details.
16 SDO O SPI Data Output. SDO is the data output for the main SPI interface. Data is clocked out on the falling edge of CLK, SDO is changed with a rising edge of CLK. See the SPI Communication section for more details.
17 VREG1 P Internal Voltage Regulator Output. VREG1 provides a 1.8V rail for internal primary-side circuits. Bypass VREG1 to GND1 with at least 4.7µF of ceramic capacitance. Do not put any additional load on VREG1.
18 GND1 G Primary Side Ground. Connect all GND1 pins together and to the PCB ground plane on the primary side.
19 VEE2 P Secondary Negative Power Supply. Connect all VEE2 supply inputs together. Connect a -12V to 0V power supply to VEE2. The total voltage rail from VCC2 to VEE2 must not exceed 30V. Bypass VEE2 to GND2 with at least 1uF of ceramic capacitance as close to the VEE1 pin as possible. See the VCC1, VCC2, and VEE2 Bypass Capacitors section for more details on selecting the values.
20 VREG2 P Internal voltage regulator output. VREG2 provides a 1.8V rail for internal secondary-side circuits. Bypass VREG2 to VEE2 with at least 4.7µF of ceramic capacitance. Do not put any additional load on VREG2.
21 AI6 I Analog Input 6. AI6 is a multi-function input. It is configurable as an input to the internal ADC, a power FET current sense protection comparator input, and an ASC input for the secondary side. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI6 to be read by the ADC. See the Shunt Resistor based Overcurrent Protection (OCP) and Short Circuit Protection (SCP) section for details on configuring AI6 as a power FET current sense protection input. Finally, see the Active Short Circuit Support (ASC) section for details on configuring AI6 as an ASC input.
22 AI5 I Analog Input 5. AI5 is a multi-function input. It is configurable as an input to the internal ADC, a power FET over temperature protection comparator input, and an ASC_EN input for the secondary side. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI5 to be read by the ADC. See the Temperature Monitoring and Protection for the Power Transistors section for details on configuring AI5 as a power FET over temperature protection input. Finally, see the Active Short Circuit Support (ASC) section for details on configuring AI5 as an ASC_EN input.
23 AI4 I Analog Input 4. AI4 is a multi-function input. It is configurable as an input to the internal ADC and a power FET current sense protection comparator input. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI4 to be read by the ADC. See the Shunt Resistor based Overcurrent Protection (OCP) and Short Circuit Protection (SCP) section for details on configuring AI4 as a power FET current sense protection input.
24 AI3 I Analog Input 3. AI3 is a multi-function input. It is configurable as an input to the internal ADC and a power FET current sense protection comparator input. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI3 to be read by the ADC. See the Temperature Monitoring and Protection for the Power Transistors section for details on configuring AI3 as a power FET over temperature protection input.
25 AI2 I Analog Input 2. AI2 is a multi-function input. It is configurable as an input to the internal ADC and a power FET current sense protection comparator input. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI2 to be read by the ADC. See the Shunt Resistor based Overcurrent Protection (OCP) and Short Circuit Protection (SCP) section for details on configuring AI2 as a power FET current sense protection input.
26 AI1 I Analog Input 1. AI1 is a multi-function input. It is configurable as an input to the internal ADC and a power FET current sense protection comparator input. See the Integrated ADC for Front-End Analog (FEA) Signal Processing section for details on configuring AI1 to be read by the ADC. See the Temperature Monitoring and Protection for the Power Transistors section for details on configuring AI1 as a power FET over temperature protection input.
27 VREF P Internal ADC Voltage Regulator Output. VREF provides an internal 4V, reference for the ADC. Bypass VREF to GND2 with at least 1uF of ceramic capacitance. If an external reference is desired, disable the internal VREF using the SPI register, and connect a 4V reference supply to VREF. Loads up to 5mA on VREF are allowed.
28 GND2 G Gate Drive Common Input. Connect GND2 to the power FET source/ IGBT emitter. All AIx inputs, VREF, and DESAT are referenced to GND2.
29 CLAMP IO Miller Clamp Input. The CLAMP input is used to hold the gate of the power FET strongly to VEE2 while the power FET is "off". CLAMP is configurable as an internal Miller clamp, or to drive an external clamping circuit. When using the internal clamping function, connect CLAMP directly the power FET gate. When configured as an external clamp, connect CLAMP to the gate of an external pulldown MOSFET. See the Active Miller Clamp section for additional details.
30 VEE2 P Secondary negative power supply. Connect all VEE2 supply inputs together. Connect a -12V to 0V power supply to VEE2. The total voltage rail from VCC2 to VEE2 must not exceed 30V. Bypass VEE2 to GND2 with at least 1uF of ceramic capacitance as close to the VEE2 pin as possible. Additional capacitance may be needed depending on the required drive current. See the VCC1, VCC2, VEE2 Bypass Capacitors section for more details on selecting the values.
31 OUTL O Negative Gate Drive Voltage Output. When the driver is active, OUTL drives the gate of the power FET low when INP is low. Connect OUTL to the gate of the power FET through a gate resistor. The value of the gate resistor is chosen based on the slew rate required for the application. See the OUTH/ OUTL Outputs section for details on choosing the gate resistor.
32 OUTH O Positive Gate Drive Voltage Output. When the driver is active, OUTH drives the gate of the power FET high when INP is high. Connect OUTH to the gate of the power FET through a gate resistor. The value of the gate resistor is chosen based on the slew rate required for the application. See the OUTH/ OUTL Outputs section for details on choosing the gate resistor.
33 VBST P Bootstrap Supply. VBST supplies power for the OUTH drive. Connect a 0.1µF ceramic capacitor between VBST and OUTH.
34 VCECLP I VCE Clamp Input. VCECLP clamps to a diode above the VCC2 rail and indicates a fault when the voltage at VCECLP is above the VCECLPth threshold. Bypass VCECLP to VEE2 with ceramic capacitor and, in parallel, connect a resistor. Additionally, connect VCECLP to the anode of a zener diode to the collector of the power FET. For details on selecting the values and ratings for the required components, see the VCECLP Input section.
35 VCC2 P Secondary Positive Power Supply. Connect a 15V to 30V power supply to VCC2. The total voltage rail from VCC2 to VEE2 must not exceed 30V. Bypass VCC2 to GND2 and VCC2 to VEE2 with bulk ceramic capacitance as close to the VCC2 pin as possible. Additional capacitance may be needed depending on the required drive current. See the VCC1, VCC2, VEE2 Bypass Capacitors section for more details on selecting the values.
36 DESAT I Desaturation based Short Circuit Detection Input. DESAT is used to detect a short circuit in the power FET. Bypass DESAT to GND2 with a ceramic capacitor to program the DESAT blanking time. In parallel, connect a schottky diode with the cathode connected to the DESAT. Additionally, connect DESAT to a resistor to the anode of a diode to the collector of the power FET to adjust the DESAT protection threshold. DESAT detects a fault when the VCE voltage of the power FET exceeds the defined threshold while the power FET is on. See the DESAT based Short Circuit Protection (DESAT) section for additional details.
(1) P = Power, G = Ground, I = Input, O = Output, - = NA