JAJSLS2D march   2013  – april 2021 UCD3138064

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Options
    1. 6.1 Device Comparison Table
    2. 6.2 Product Selection Matrix
  8. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Functions
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings #GUID-DB56AA00-A5E9-4426-9853-ACC9CCD10656/SLUSB727999
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Characteristics
    7. 8.7  PMBus/SMBus/I2C Timing
    8. 8.8  Power On Reset (POR) / Brown Out Reset (BOR)
    9. 8.9  Typical Clock Gating Power Savings
    10. 8.10 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ARM Processor
      2. 9.1.2 Memory
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  System Module
        1. 9.3.1.1 Address Decoder (DEC)
        2. 9.3.1.2 Memory Management Controller (MMC)
        3. 9.3.1.3 System Management (SYS)
        4. 9.3.1.4 Central Interrupt Module (CIM)
      2. 9.3.2  Peripherals
        1. 9.3.2.1 Digital Power Peripherals
          1. 9.3.2.1.1 Front End
          2. 9.3.2.1.2 DPWM Module
          3. 9.3.2.1.3 DPWM Events
          4. 9.3.2.1.4 High Resolution DPWM
          5. 9.3.2.1.5 Over Sampling
          6. 9.3.2.1.6 DPWM Interrupt Generation
          7. 9.3.2.1.7 DPWM Interrupt Scaling/Range
      3. 9.3.3  Automatic Mode Switching
        1. 9.3.3.1 Phase Shifted Full Bridge Example
        2. 9.3.3.2 LLC Example
        3. 9.3.3.3 Mechanism For Automatic Mode Switching
      4. 9.3.4  DPWMC, Edge Generation, Intramux
      5. 9.3.5  Filter
        1. 9.3.5.1 Loop Multiplexer
        2. 9.3.5.2 Fault Multiplexer
      6. 9.3.6  Communication Ports
        1. 9.3.6.1 SCI (UART) Serial Communication Interface
        2. 9.3.6.2 PMBUS/I2C
        3. 9.3.6.3 SPI
      7. 9.3.7  Real Time Clock
      8. 9.3.8  Timers
        1. 9.3.8.1 24-Bit Timer
        2. 9.3.8.2 16-Bit PWM Timers
        3. 9.3.8.3 Watchdog Timer
      9. 9.3.9  General Purpose ADC12
      10. 9.3.10 Miscellaneous Analog
      11. 9.3.11 Brownout
      12. 9.3.12 Global I/O
      13. 9.3.13 Temperature Sensor Control
      14. 9.3.14 I/O Mux Control
      15. 9.3.15 Current Sharing Control
      16. 9.3.16 Temperature Reference
    4. 9.4 Device Functional Modes
      1. 9.4.1 DPWM Modes Of Operation
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Phase Shifting
        3. 9.4.1.3 DPWM Multiple Output Mode
        4. 9.4.1.4 DPWM Resonant Mode
      2. 9.4.2 Triangular Mode
      3. 9.4.3 Leading Edge Mode
    5. 9.5 Memory
      1. 9.5.1 Register Maps
        1. 9.5.1.1 CPU Memory Map and Interrupts
          1. 9.5.1.1.1 Memory Map (After Reset Operation)
          2. 9.5.1.1.2 Memory Map (Normal Operation)
          3. 9.5.1.1.3 Memory Map (System and Peripherals Blocks)
        2. 9.5.1.2 Boot ROM
        3. 9.5.1.3 Customer Boot Program
        4. 9.5.1.4 Flash Management
        5. 9.5.1.5 Synchronous Rectifier MOSFET Ramp and IDE Calculation
  11. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
          1. 10.2.2.2.1 DPWM Synchronization
        3. 10.2.2.3 Fixed Signals to Bridge
        4. 10.2.2.4 Dynamic Signals to Bridge
        5. 10.2.2.5 System Initialization for PCM
          1. 10.2.2.5.1 Use of Front Ends and Filters in PSFB
          2. 10.2.2.5.2 Peak Current Detection
          3. 10.2.2.5.3 Peak Current Mode (PCM)
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
    1. 11.1 Introduction To Power Supply and Layout Recommendations
    2. 11.2 3.3-V Supply Pins
    3. 11.3 Recommendation for V33 Ramp up Slew Rate for UCD3138 and UCD3138064
    4. 11.4 Recommendation for RC Time Constant of RESET Pin for UCD3138 and UCD3138064
  13. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 EMI and EMC Mitigation Guidelines
      2. 12.1.2 BP18 Pin
      3. 12.1.3 Additional Bias Guidelines
      4.      UCD3138 Pin Connection Recommendation
        1. 12.1.4.1 Current Amplifier With EADC Connection
        2. 12.1.4.2 DPWM Synchronization
        3. 12.1.4.3 External Clock
        4. 12.1.4.4 GPIOS
        5. 12.1.4.5 DPWM PINS
        6. 12.1.4.6 EAP and EAN Pins
        7. 12.1.4.7 ADC Pins
          1. 12.1.4.7.1 RESET Pin
      5. 12.1.4 UART Communication Port
      6.      Special Considerations
    2. 12.2 Layout Example
      1. 12.2.1 UCD3138 and UCD3138064 40 Pin
      2. 12.2.2 UCD3138 and UCD3138064 64 Pin
  14. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Trademarks
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 用語集
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

Abstract

  • The first thing that must be done in any layout is to set up the basic grounding strategy and the placement of the decoupling capacitors. This needs to be prioritized over anything else, even the routing of sensitive feedback signals.
  • If a gate driver device such as UCC27524 or UCC27511 is on the control card and there is a PGND connection, a net-short resistor or large copper trace must be used to tie the PGND to the Power RTN by multiple vias. Also, the net-short element between Power RTN and PGND must be close to the driver IC.
  • Unused ADC pins must be tied to SGND.
  • Avoid putting V33D and V33A long traces or planes close to radiation components. Place them into an internal layer. It is preferred to have ground shielding.
  • Avoid putting bias supplies or SGND or Power RTN directly to across the switching power train where they can couple switching noise. If the grounds are coupled with noise, the decoupling capacitors may not be effective at filtering the noise out.
  • Local capacitors are preferred to provide a short path for switching current, and be careful to select a quiet RETURN point to connect.
  • In a power module or a tiny PCB design, a single solid plane without the grounding separation is shown in Single Ground Plane for a Power Module Design and has a single point connection with power RTN or SGND near the connector. Ensure there is no current flow from power train into the signal ground plane.
    GUID-17AE9C74-A8B2-46D4-9567-3DB0AE225313-low.png Figure 12-8 Single Ground Plane for a Power Module Design