JAJSMV1E March   2005  – November 2021 UCD7100

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input
      2. 9.3.2 Current Sensing and Protection
      3. 9.3.3 Handshaking
      4. 9.3.4 Driver Output
      5. 9.3.5 Source/Sink Capabilities During Miller Plateau
      6. 9.3.6 Drive Current and Power Requirements
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with VDD < 4.25 V (minimum VDD)
      2. 9.4.2 Operation with IN Pin Open
      3. 9.4.3 Operation with ILIM Pin Open
      4. 9.4.4 Operation with ILIM Pin High
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Supply
    2. 11.2 Reference and External Bias Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Documentation Support
      1. 13.3.1 Related Documentation
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 サポート・リソース
    6. 13.6 Trademarks
    7. 13.7 Glossary
    8. 13.8 Electrostatic Discharge Caution
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PWP|14
サーマルパッド・メカニカル・データ
発注情報

12.3 Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the device package. In order for a power driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCD7K family of drivers is available in PowerPAD™ TSSOP package to cover a range of application requirements. Both have the exposed pads to relieve thermal dissipation from the semiconductor junction.

As illustrated in Reference [2], the PowerPAD™ packages offer a leadframe die pad that is exposed at the base of the package. This pad is soldered to the copper on the PC board (PCB) directly underneath the device package, reducing the ΘJC down to 4.7°C/W. The PC board must be designed with thermal lands and thermal vias to complete the heat removal subsystem, as summarized in Reference [3].

Note that the PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device.