JAJSHD6B August   2016  – May  2019 UCD90320

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     アプリケーション概略図
  4. 4 改訂履歴
  5. 5 概要(続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Non-Volatile Memory Characteristics
    7. 7.7 I2C/PMBus Interface Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TI Fusion Digital Power Designer software
      2. 8.3.2 PMBUS Interface
      3. 8.3.3 Rail Setup
    4. 8.4 Device Functional Modes
      1. 8.4.1  Rail Monitoring Configuration
      2. 8.4.2  GPI Configuration
      3. 8.4.3  Rail Sequence Configuration
      4. 8.4.4  Fault Responses Configuration
      5. 8.4.5  GPO Configuration
        1. 8.4.5.1 Command Controlled GPO
        2. 8.4.5.2 Logic GPO
      6. 8.4.6  Margining Configuration
      7. 8.4.7  Pin Selected Rail States Configuration
      8. 8.4.8  Watchdog Timer
      9. 8.4.9  System Reset Function
      10. 8.4.10 Cascading Multiple Devices
      11. 8.4.11 Rail Monitoring
      12. 8.4.12 Status Monitoring
      13. 8.4.13 Data and Error Logging to EEPROM Memory
      14. 8.4.14 Black Box First Fault Logging
      15. 8.4.15 PMBus Address Selection
      16. 8.4.16 ADC Reference
      17. 8.4.17 Device Reset
      18. 8.4.18 Brownout
      19. 8.4.19 Internal Fault Management
    5. 8.5 Device Configuration and Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 コミュニティ・リソース
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) UCD90320 UNIT
ZWS (BGA)
169 PINS
RθJA Junction-to-ambient thermal resistance(2)(6) 41.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance(2) 15.8 °C/W
RθJB Junction-to-board thermal resistance(2)(5)(7) 18.9 °C/W
ψJT Junction-to-top characterization parameter(4) 0.3 °C/W
ψJB Junction-to-board characterization parameter(5) 20.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Junction to ambient thermal resistance (θJA), junction to board thermal resistance (θJB), and junction to case thermal resistance (θJC) numbers are determined by a package simulator.
(3) TB is temperature of the board.
(4) TJ = TC + (P × ΨJT)
(5) TJ = TPCB + (P × ΨJB)
(6) TJ = TA + (P × θJA)
(7) TJ = TB + (P × θJB)(3)