SLVS813C June   2008  – November 2016 UCD9081

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements: I2C Interface
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail Configuration
      2. 8.3.2 Graphical User Interface (GUI)
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Supply Sequencing
      2. 8.4.2  Power-Supply Enables
      3. 8.4.3  General-Purpose Outputs
      4. 8.4.4  Device Reset
      5. 8.4.5  Voltage Reference
      6. 8.4.6  Voltage Monitoring
      7. 8.4.7  Rail Shutdown
      8. 8.4.8  Alarm Processing
        1. 8.4.8.1 Ignore
        2. 8.4.8.2 Log Only
        3. 8.4.8.3 Retry n Times
        4. 8.4.8.4 Retry Continuously
        5. 8.4.8.5 Sequence
        6. 8.4.8.6 Sequence After Shutdown
      9. 8.4.9  Error Logging
      10. 8.4.10 Brownout
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Configuring and Monitoring the UCD9081
      3. 8.5.3 Resetting the Flash Error Log
      4. 8.5.4 Configuring the UCD9081
      5. 8.5.5 User Data
      6. 8.5.6 I2C Address Selection
      7. 8.5.7 I2C Transactions
        1. 8.5.7.1 I2C Unidirectional Transfer
        2. 8.5.7.2 I2C Combined Format
    6. 8.6 Register Maps
      1. 8.6.1  Register Descriptions
      2. 8.6.2  RAIL
      3. 8.6.3  ERROR
      4. 8.6.4  STATUS
      5. 8.6.5  VERSION
      6. 8.6.6  RAILSTATUS
      7. 8.6.7  FLASHLOCK
      8. 8.6.8  RESTART
      9. 8.6.9  WADDR and WDATA
      10. 8.6.10 Reading the FLASH Error Log
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Considerations for MONX Input Series Resistance, RS
      2. 9.1.2 Estimating UCD9081 Reporting Accuracy Over Variations in ADC Voltage Reference
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

PowerPAD, TMS320, E2E are trademarks of Texas Instruments.

Windows is a trademark of Microsoft Corporation.

I2C is a trademark of Phillips Electronics.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.